Taiwan semiconductor manufacturing company, ltd. (20240379505). Bond Films for Reduced Thermal Resistance and Methods Forming the Same simplified abstract
Contents
Bond Films for Reduced Thermal Resistance and Methods Forming the Same
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Ming-Tsu Chung of Hsinchu (TW)
Kuang-Wei Cheng of Hsinchu (TW)
Yung-Chi Lin of Su-Lin City (TW)
Bond Films for Reduced Thermal Resistance and Methods Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379505 titled 'Bond Films for Reduced Thermal Resistance and Methods Forming the Same
The method described in the patent application involves forming a feature for a first package component, which includes a planarization process to level the top surface of the feature. A silicon-containing dielectric layer is then deposited over and in contact with the feature, serving as a surface feature of the first package component. Subsequently, a second package component is bonded to the silicon-containing dielectric layer through fusion bonding. Importantly, the silicon-containing dielectric layer maintains the same thickness throughout both the deposition and fusion bonding steps.
- Feature formation for a first package component
- Planarization process to level the top surface of the feature
- Deposition of a silicon-containing dielectric layer over the feature
- Fusion bonding of a second package component to the dielectric layer
- Maintaining consistent thickness of the dielectric layer throughout the process
Potential Applications: - Semiconductor packaging - Microelectronics manufacturing - Integrated circuit assembly
Problems Solved: - Ensuring proper bonding between package components - Achieving uniformity in feature formation - Enhancing the reliability of semiconductor devices
Benefits: - Improved structural integrity of package components - Enhanced performance of integrated circuits - Increased efficiency in manufacturing processes
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics. It can also benefit industries involved in aerospace, telecommunications, and medical devices.
Questions about the technology: 1. How does the fusion bonding process contribute to the overall reliability of the package components? 2. What are the specific advantages of using a silicon-containing dielectric layer in semiconductor packaging?
Original Abstract Submitted
a method includes forming feature for a first package component, and the forming the feature includes a planarization process to level a top surface of the feature. a silicon-containing dielectric layer is deposited over and contacting the feature, and as a surface feature of the first package component. a second package component is bonded to the silicon-containing dielectric layer through fusion bonding. the silicon-containing dielectric layer has a same thickness in both steps of the depositing and the fusion bonding.
