Taiwan semiconductor manufacturing company, ltd. (20240379501). PACKAGE STRUCTURE simplified abstract
Contents
PACKAGE STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsien-Wei Chen of Hsinchu City (TW)
Jie Chen of New Taipei City (TW)
Ming-Fa Chen of Taichung City (TW)
Sung-Feng Yeh of Taipei City (TW)
PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379501 titled 'PACKAGE STRUCTURE
The patent application describes a package structure that includes two semiconductor dies encapsulated by insulating materials and a bonding enhancement film.
- The first insulating encapsulation surrounds a portion of the first semiconductor die, while the bonding enhancement film covers another part of the first die, leveling with its surface.
- The second semiconductor die is placed on top of the first die and bonded to it and the bonding enhancement film.
- The second insulating encapsulation encapsulates the second semiconductor die laterally.
Potential Applications: - This technology can be used in the manufacturing of integrated circuits and electronic devices. - It can improve the reliability and performance of semiconductor packages in various applications.
Problems Solved: - Provides enhanced bonding between semiconductor dies. - Ensures proper encapsulation and protection of the semiconductor components.
Benefits: - Improved reliability and performance of electronic devices. - Enhanced structural integrity of semiconductor packages.
Commercial Applications: - This technology can be applied in the production of consumer electronics, automotive electronics, and industrial equipment.
Questions about the technology: 1. How does the bonding enhancement film improve the bonding between semiconductor dies? 2. What are the potential cost savings associated with using this package structure in semiconductor manufacturing?
Original Abstract Submitted
a package structure including a first semiconductor die, a first insulating encapsulation, a bonding enhancement film, a second semiconductor die and a second insulating encapsulation is provided. the first insulating encapsulation laterally encapsulates a first portion of the first semiconductor die. the bonding enhancement film is disposed on a top surface of the first insulating encapsulation and laterally encapsulates a second portion of the first semiconductor die, wherein a top surface of the bonding enhancement film is substantially leveled with a top surface of the semiconductor die. the second semiconductor die is disposed on and bonded to the first semiconductor die and the bonding enhancement film. the second insulating encapsulation laterally encapsulates the second semiconductor die.