Taiwan semiconductor manufacturing company, ltd. (20240379494). HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS simplified abstract
Contents
HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Po-Yao Lin of Zhudong Township (TW)
HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379494 titled 'HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS
The semiconductor structure described in the patent application consists of a substrate with a package attached to one surface. The package includes an interposer bonded to the substrate through conductive bumps, dies attached to the interposer, and a molding material around the dies. Additionally, there are thermal interface material (TIM) films on the package's surface, directly over each die, and a heat-dissipation lid attached to the substrate, enclosing the package and TIM films in a space.
- The semiconductor structure includes a substrate, a package with an interposer, dies, and a molding material, TIM films, and a heat-dissipation lid.
- The interposer is bonded to the substrate through conductive bumps, with dies attached to the other side and surrounded by a molding material.
- TIM films are placed on the package's surface, directly over each die, to enhance thermal conductivity.
- A heat-dissipation lid is attached to the substrate, enclosing the package and TIM films in a space to dissipate heat effectively.
Potential Applications: - This semiconductor structure can be used in high-performance computing systems. - It can also find applications in data centers and server farms where efficient heat dissipation is crucial.
Problems Solved: - Improved thermal management in semiconductor devices. - Enhanced performance and reliability of electronic systems.
Benefits: - Better heat dissipation capabilities. - Increased longevity and efficiency of electronic components.
Commercial Applications: Title: Advanced Semiconductor Structure for Enhanced Heat Dissipation This technology can be utilized in the development of high-performance computing systems, data centers, and server farms to improve thermal management and overall system reliability. The market implications include increased demand for efficient heat dissipation solutions in the electronics industry.
Questions about the technology: 1. How does the semiconductor structure improve thermal management in electronic devices? 2. What are the potential commercial applications of this technology in the semiconductor industry?
Original Abstract Submitted
a semiconductor structure includes: a substrate; a package attached to a first surface of the substrate, where the package includes: an interposer, where a first side of the interposer is bonded to the first surface of the substrate through first conductive bumps; dies attached to a second side of the interposer opposing the first side; and a molding material on the second side of the interposer around the dies; a plurality of thermal interface material (tim) films on a first surface of the package distal from the substrate, where each of the tim films is disposed directly over at least one respective die of the dies; and a heat-dissipation lid attached to the first surface of the substrate, where the package and the plurality of tim films are disposed in an enclosed space between the heat-dissipation lid and the substrate, where the heat-dissipation lid contacts the plurality of tim films.
