Taiwan semiconductor manufacturing company, ltd. (20240379491). METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chin-Fu Kao of Taipei City (TW)

Chen-Shien Chen of Hsinchu County (TW)

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379491 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

The manufacturing method of a semiconductor package involves providing a package structure over a substrate, filling a gap between device dies with a filling material, adding a thermal spreader layer with a discontinuous thickness profile at the gap region, and placing a lid structure over the substrate and in contact with the thermal spreader layer.

• Package structure with device dies and filling material
• Discontinuous thickness profile of thermal spreader layer at gap region
• Lid structure in contact with thermal spreader layer
• Enhanced thermal management in semiconductor packaging
• Improved heat dissipation and overall performance

Potential Applications: - Semiconductor industry for electronic devices - High-performance computing systems - Automotive electronics - Aerospace applications - Medical devices

Problems Solved: - Overheating issues in semiconductor packages - Thermal management challenges in electronic devices - Ensuring reliability and longevity of electronic components

Benefits: - Improved thermal performance - Enhanced reliability of electronic devices - Extended lifespan of semiconductor packages - Better overall efficiency in electronic systems

Commercial Applications: Title: Advanced Thermal Management Solutions for Semiconductor Packaging This technology can be utilized in various commercial applications such as: - Consumer electronics - Telecommunications equipment - Industrial automation systems - Data centers - Military and defense technologies

Questions about Semiconductor Package Manufacturing: 1. How does the discontinuous thickness profile of the thermal spreader layer improve heat dissipation in the semiconductor package? 2. What are the key advantages of using a lid structure in contact with the thermal spreader layer in semiconductor packaging?

Frequently Updated Research: Ongoing research in the semiconductor industry focuses on developing more efficient thermal management solutions for electronic devices. Researchers are exploring novel materials and designs to enhance heat dissipation and overall performance in semiconductor packages. Stay updated on the latest advancements in thermal management technologies to optimize the performance of electronic systems.

Original Abstract Submitted

a manufacturing method of a semiconductor package includes the following steps. a package structure is provided over a substrate, wherein the package structure includes a plurality of device dies and a filling material filling a gap between adjacent two of the plurality of device dies. a thermal spreader layer is provided over the package structure, wherein the thermal spreader layer has a profile that is discontinuous in thickness at a gap region aligned with the gap. a lid structure is provided over the substrate and in contact with the thermal spreader layer.