Taiwan semiconductor manufacturing company, ltd. (20240379488). SEMICONDUCTOR PACKAGE simplified abstract

SEMICONDUCTOR PACKAGE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chin-Hua Wang of New Taipei City (TW)

Po-Yao Lin of Zhudong Township (TW)

Feng-Cheng Hsu of New Taipei City (TW)

Shin-Puu Jeng of Po-Shan Village (TW)

Wen-Yi Lin of New Taipei City (TW)

Shu-Shen Yeh of Taoyuan City (TW)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379488 titled 'SEMICONDUCTOR PACKAGE

The semiconductor package described in the patent application consists of a first chip placed on a first package substrate, surrounded by a molding compound, with a first thermal interface material covering the chip and the molding compound, a heat spreader on top of the thermal interface material, and a second thermal interface material over the heat spreader. Importantly, the first and second thermal interface materials have the same width.

• The semiconductor package includes a unique arrangement of thermal interface materials with identical widths.
• The design aims to optimize heat dissipation and thermal management within the package.
• This innovation could potentially improve the overall performance and reliability of semiconductor devices.
• By ensuring uniform thermal conductivity, the package may enhance the longevity of the chips and reduce the risk of overheating.
• The use of identical width thermal interface materials may simplify manufacturing processes and reduce costs.

Potential Applications: - This technology could be applied in various electronic devices such as computers, smartphones, and automotive electronics. - It may find use in high-performance computing systems, servers, and data centers where efficient thermal management is crucial.

Problems Solved: - Addresses the challenge of thermal dissipation in semiconductor packages. - Helps prevent overheating and potential damage to electronic components. - Enhances the overall reliability and performance of semiconductor devices.

Benefits: - Improved heat dissipation and thermal management. - Enhanced reliability and longevity of semiconductor devices. - Potential cost savings in manufacturing processes.

Commercial Applications: Title: Enhanced Thermal Management in Semiconductor Packages This technology could be valuable in the consumer electronics industry, data centers, and automotive electronics sector. It offers a solution to the critical issue of heat dissipation in semiconductor devices, potentially improving performance and reliability.

Questions about Semiconductor Package Thermal Management: 1. How does the use of identical width thermal interface materials benefit the overall performance of semiconductor devices? - The identical width thermal interface materials help optimize heat dissipation and thermal management within the semiconductor package, leading to improved performance and reliability. 2. What potential applications could benefit the most from this innovative semiconductor package design? - Various electronic devices such as computers, smartphones, and automotive electronics could benefit from this technology due to its efficient thermal management capabilities.

Original Abstract Submitted

a semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. the first thermal interface material and the second thermal interface material have an identical width.