Taiwan semiconductor manufacturing company, ltd. (20240379482). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Hung-Pin Chang of New Taipei City (TW)

Der-Chyang Yeh of Hsin-Chu (TW)

Wei-Cheng Wu of Hsinchu City (TW)

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379482 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

The semiconductor device described in the abstract includes an integrated circuit (IC) die and an encapsulant. The IC die consists of a semiconductor substrate and an interconnect structure connected to the substrate, with the substrate having a first ledge and the interconnect structure having a second ledge. The encapsulant covers both ledges of the semiconductor substrate and the interconnect structure.

• The semiconductor device comprises an IC die with a semiconductor substrate and an interconnect structure.
• The semiconductor substrate features a first ledge, while the interconnect structure includes a second ledge.
• The encapsulant extends along both the first ledge of the semiconductor substrate and the second ledge of the interconnect structure.

Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.

Problems Solved: - Provides protection and insulation for the IC die components. - Ensures proper functioning and longevity of the semiconductor device.

Benefits: - Enhanced durability and reliability of electronic devices. - Improved performance and efficiency of integrated circuits.

Commercial Applications: Title: Semiconductor Device Encapsulant Technology for Enhanced Electronics This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, medical devices, and industrial equipment. It offers improved protection and reliability for integrated circuits, leading to better overall performance and longevity of electronic devices.

Questions about Semiconductor Device Encapsulant Technology: 1. How does the encapsulant material contribute to the protection of the IC die components?

  The encapsulant material acts as a barrier against external factors such as moisture, dust, and physical damage, safeguarding the semiconductor substrate and interconnect structure.

2. What are the potential market implications of implementing this semiconductor device technology in various industries?

  By enhancing the durability and reliability of electronic devices, this technology can lead to increased consumer trust, reduced maintenance costs, and improved product performance across different sectors.

Original Abstract Submitted

a semiconductor device and a forming method thereof are provided. the semiconductor device includes an integrated circuit (ic) die and an encapsulant. the ic die includes a semiconductor substrate and an interconnect structure connected to the semiconductor substrate, the semiconductor substrate includes a first ledge, and the interconnect structure includes a second ledge. the encapsulant extends along the first ledge of the first semiconductor substrate and the second ledge of the first interconnect structure.