Taiwan semiconductor manufacturing company, ltd. (20240379475). PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract
Contents
PACKAGE STRUCTURE WITH PROTECTIVE LID
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wen-Yi Lin of New Taipei City (TW)
Kuang-Chun Lee of New Taipei City (TW)
Chen-Shien Chen of Zhubei City (TW)
PACKAGE STRUCTURE WITH PROTECTIVE LID - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379475 titled 'PACKAGE STRUCTURE WITH PROTECTIVE LID
The abstract of the patent application describes a package structure that includes a substrate, a ground structure surrounded by the substrate, a chip-containing structure, and a protective lid attached to the substrate through adhesive elements.
- The ground structure is electrically connected to the protective lid through the first adhesive element.
- The second adhesive element is positioned closer to a corner edge of the substrate than the first adhesive element.
- A portion of the second adhesive element is located between the first adhesive element and the chip-containing structure.
Potential Applications: - This package structure could be used in electronic devices to protect and secure chips. - It could be utilized in the manufacturing of various consumer electronics such as smartphones, tablets, and laptops.
Problems Solved: - Provides a secure and reliable packaging solution for delicate electronic components. - Ensures proper electrical connection between the ground structure and the protective lid.
Benefits: - Enhanced protection for chips and other electronic components. - Improved reliability and durability of electronic devices.
Commercial Applications: - The technology could be valuable for electronics manufacturers looking to enhance the quality and longevity of their products. - It may have applications in industries where secure packaging of electronic components is crucial.
Questions about the technology: 1. How does the positioning of the second adhesive element contribute to the overall stability of the package structure? 2. What are the specific advantages of having the ground structure electrically connected to the protective lid?
Frequently Updated Research: - Stay updated on advancements in packaging technology for electronic components to ensure the latest innovations are incorporated into the design.
Original Abstract Submitted
a package structure is provided. the package structure includes a substrate and a ground structure laterally surrounded by the substrate. the package structure also includes a chip-containing structure over the substrate and a protective lid attached to the substrate through a first adhesive element and a second adhesive element. the ground structure is electrically connected to the protective lid through the first adhesive element. the second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and a portion of the second adhesive element is between the first adhesive element and the chip-containing structure.
