Taiwan semiconductor manufacturing company, ltd. (20240379470). END POINT CONTROL IN ETCHING PROCESSES simplified abstract
Contents
END POINT CONTROL IN ETCHING PROCESSES
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Jui Fu Hsieh of Zhubei City (TW)
Chia-Chi Yu of New Taipei City (TW)
Chih-Teng Liao of Hsinchu (TW)
Chia-Cheng Tai of Tainan City (TW)
END POINT CONTROL IN ETCHING PROCESSES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379470 titled 'END POINT CONTROL IN ETCHING PROCESSES
The method described in the patent application involves determining a target etching depth for etching multiple dielectric regions in a wafer containing protruding semiconductor fins. The dielectric regions are located between these semiconductor fins. The method includes etching the dielectric regions, projecting a light beam onto the wafer, generating a spectrum from the reflected light, and determining an end point for etching based on the spectrum. The end point is a predetermined time point, and the etching process is stopped at this point to achieve the target etching depth.
- The method involves etching dielectric regions in a wafer with protruding semiconductor fins.
- A light beam is projected onto the wafer, and a spectrum is generated from the reflected light.
- The end point for etching is determined based on the spectrum, which is a predetermined time point.
- The etching process is stopped at this end point to achieve the target etching depth.
Potential Applications: This technology can be applied in the semiconductor industry for precise etching of dielectric regions in wafers with semiconductor fins. It can improve the manufacturing process of integrated circuits by ensuring accurate etching depths.
Problems Solved: This technology addresses the challenge of achieving precise etching depths in dielectric regions between semiconductor fins in wafers. It provides a method to stop the etching process at the desired depth, enhancing the quality and performance of semiconductor devices.
Benefits: - Improved accuracy in etching dielectric regions - Enhanced quality and performance of semiconductor devices - Streamlined manufacturing process for integrated circuits
Commercial Applications: Title: Advanced Etching Technology for Semiconductor Manufacturing This technology can be utilized by semiconductor companies for the production of high-performance integrated circuits. It can improve the efficiency and accuracy of etching processes, leading to better semiconductor device performance in various electronic applications.
Questions about the technology: 1. How does the method of determining the end point for etching based on the spectrum improve the etching process? 2. What are the potential cost-saving benefits of using this technology in semiconductor manufacturing processes?
Original Abstract Submitted
a method includes determining a target etching depth for etching a plurality of dielectric regions in a wafer. the wafer includes a plurality of protruding semiconductor fins and the plurality of dielectric regions between the plurality of protruding semiconductor fins. the method further includes etching the plurality of dielectric regions, projecting a light beam on the wafer, and generating a spectrum from a reflected light reflected from the wafer, determining an end point for etching based on the spectrum. the end point is an expected time point. the plurality of dielectric regions are etched to the target etching depth. the etching of the plurality of dielectric regions is stopped at the end point.
