Taiwan semiconductor manufacturing company, ltd. (20240379468). PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE simplified abstract
Contents
PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hau-Yi Hsiao of Chiayi City (TW)
Kuo-Ming Wu of Zhubei City (TW)
Chun Liang Chen of Tainan City (TW)
Sheng-Chau Chen of Tainan City (TW)
PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379468 titled 'PROCESS TOOL FOR ANALYZING BONDED WORKPIECE INTERFACE
The present disclosure pertains to a method and associated process tool involving the use of electromagnetic radiation to detect the interface between bonded workpieces.
- Generating electromagnetic radiation directed towards the perimeter of bonded workpieces and a radiation sensor.
- Scanning the electromagnetic radiation along a vertical axis.
- Measuring the intensity of the radiation that reaches the sensor during scanning.
- Recording intensity values at different positions along the vertical axis to determine the interface position.
- Determining the interface based on the maximum measured intensity value.
Potential Applications: - Quality control in manufacturing processes. - Non-destructive testing of bonded materials. - Industrial automation for precise bonding detection.
Problems Solved: - Accurately locating the interface between bonded workpieces. - Ensuring the integrity of bonded joints. - Improving efficiency in manufacturing processes.
Benefits: - Enhanced quality control. - Increased productivity. - Cost savings through early detection of bonding issues.
Commercial Applications: Title: Non-Destructive Bonding Interface Detection Tool This technology can be utilized in industries such as automotive, aerospace, and electronics for quality assurance and process optimization.
Questions about the technology: 1. How does this method improve upon traditional bonding inspection techniques? 2. What are the potential limitations of using electromagnetic radiation for interface detection in bonded workpieces?
Frequently Updated Research: Stay updated on advancements in non-destructive testing methods for bonded materials to enhance the efficiency and accuracy of interface detection processes.
Original Abstract Submitted
the present disclosure relates to a method and an associated process tool. the method includes generating electromagnetic radiation that is directed toward a perimeter of a pair of bonded workpieces and toward a radiation sensor that is arranged behind the perimeter of the pair of bonded workpieces. the electromagnetic radiation is scanned along a vertical axis. an intensity of the electromagnetic radiation that impinges on the radiation sensor is measured throughout the scanning. measuring the intensity includes recording a plurality of intensity values of the electromagnetic radiation at a plurality of different positions along the vertical axis extending past top and bottom surfaces of the pair of bonded workpieces. a position of an interface between the pair of bonded workpieces is determined based on a maximum measured intensity value of the plurality of intensity values.
