Taiwan semiconductor manufacturing company, ltd. (20240379439). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
Contents
SEMICONDUCTOR DEVICE AND METHOD
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Ming-Fa Chen of Taichung City (TW)
Tzuan-Horng Liu of Longtan Township (TW)
Chao-Wen Shih of Zhubei City (TW)
SEMICONDUCTOR DEVICE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379439 titled 'SEMICONDUCTOR DEVICE AND METHOD
Simplified Explanation: The method described in the patent application involves creating a through substrate via by forming interconnect structures, coating openings with barrier layers, depositing liners, and filling with conductive material.
- The method involves forming a first interconnect structure over a substrate.
- Patterning the interconnect structure to create an opening.
- Coating the opening with a barrier layer.
- Etching a second opening through the barrier layer and substrate.
- Depositing a liner in both openings.
- Filling the openings with a conductive material.
- Thinning the substrate to expose the conductive material, forming a through substrate via.
Potential Applications: This technology can be used in semiconductor manufacturing, integrated circuits, and electronic devices where through substrate vias are needed for improved connectivity.
Problems Solved: This method solves the problem of creating through substrate vias efficiently and reliably in complex electronic devices.
Benefits: The benefits of this technology include improved signal transmission, reduced signal interference, and enhanced overall performance of electronic devices.
Commercial Applications: This technology can be applied in the production of advanced electronic devices such as smartphones, tablets, computers, and other high-tech gadgets to enhance their functionality and connectivity.
Questions about Through Substrate Vias: 1. How does the method of forming through substrate vias differ from traditional via formation techniques? 2. What are the key advantages of using through substrate vias in electronic devices?
Frequently Updated Research: Researchers are continuously exploring new materials and processes to further improve the efficiency and reliability of through substrate vias in electronic devices. Stay updated on the latest advancements in this field for potential future applications.
Original Abstract Submitted
an embodiment is a method including forming a first interconnect structure over a first substrate, the first interconnect structure comprising dielectric layers and metallization patterns therein, patterning the first interconnect structure to form a first opening, coating the first opening with a barrier layer, etching a second opening through the barrier layer and the exposed portion of the first substrate, depositing a liner in the first opening and the second opening, filling the first opening and the second opening with a conductive material, and thinning the first substrate to expose a portion of the conductive material in the second opening, the conductive material extending through the first interconnect structure and the first substrate forming a through substrate via.
