Taiwan semiconductor manufacturing company, ltd. (20240379400). WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPERATURE UNIFORMITY simplified abstract
Contents
WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPERATURE UNIFORMITY
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Ting-Jung Chen of Kaohsiung City (TW)
Shih-Wei Lin of Taipei City (TW)
Lee-Chuan Tseng of New Taipei City (TW)
WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPERATURE UNIFORMITY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379400 titled 'WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPERATURE UNIFORMITY
The patent application describes a process tool with a chamber housing and a wafer chuck structure for holding a wafer during fabrication.
- The wafer chuck structure has a lower portion with trenches and an upper portion with openings directly overlying the trenches.
- Cooling gas piping is connected to the trenches for cooling, enhancing the fabrication process.
- The cooling gas source is linked to the cooling gas piping for efficient cooling of the wafer chuck structure.
- The design allows for precise control of temperature during the fabrication process.
- The innovative structure improves the quality and efficiency of wafer fabrication processes.
Potential Applications: This technology can be used in semiconductor manufacturing, specifically in processes involving wafer fabrication.
Problems Solved: The technology addresses the need for precise temperature control during wafer fabrication processes, improving quality and efficiency.
Benefits: Enhanced temperature control, improved quality of fabricated wafers, increased efficiency in manufacturing processes.
Commercial Applications: Title: Advanced Wafer Chuck Structure for Semiconductor Manufacturing This technology can be applied in semiconductor fabrication facilities to improve the quality and efficiency of wafer production, potentially leading to cost savings and enhanced product performance.
Prior Art: Readers can explore prior patents related to wafer chuck structures in semiconductor manufacturing to understand the evolution of this technology.
Frequently Updated Research: Stay updated on the latest advancements in wafer chuck structures and semiconductor manufacturing processes to leverage the most cutting-edge technologies in the field.
Questions about Wafer Chuck Structures: 1. How does the cooling gas piping in the wafer chuck structure contribute to the fabrication process? 2. What are the key advantages of having openings directly overlying the trenches in the wafer chuck structure?
Original Abstract Submitted
in some embodiments, the present disclosure relates to a process tool that includes a chamber housing defined by a processing chamber, and a wafer chuck structure arranged within the processing chamber. the wafer chuck structure is configured to hold a wafer during a fabrication process. the wafer chuck includes a lower portion and an upper portion arranged over the lower portion. the lower portion includes trenches extending from a topmost surface towards a bottommost surface of the lower portion. the upper portion includes openings that are holes, extend completely through the upper portion, and directly overlie the trenches of the lower portion. multiple of the openings directly overlie each trench. further, cooling gas piping is coupled to the trenches of the lower portion of the wafer chuck structure, and a cooling gas source is coupled to the cooling gas piping.
