Taiwan semiconductor manufacturing company, ltd. (20240379387). SMALL GAS FLOW MONITORING OF DRY ETCHER BY OES SIGNAL simplified abstract
Contents
SMALL GAS FLOW MONITORING OF DRY ETCHER BY OES SIGNAL
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Po-Lung Hung of Baoshan Township (TW)
Yi-Tsang Hsieh of Hsinchu City (TW)
Yu-Hsi Tang of Yunlin County (TW)
Chih-Teng Liao of Hsinchu City (TW)
Chih-Ching Cheng of Xizhou Township (TW)
SMALL GAS FLOW MONITORING OF DRY ETCHER BY OES SIGNAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379387 titled 'SMALL GAS FLOW MONITORING OF DRY ETCHER BY OES SIGNAL
Simplified Explanation: The patent application describes a method for controlling a plasma beam in a plasma etcher by setting flow rates of an etching gas and monitoring emitted light from the plasma discharge.
- The flow rate controller of the plasma etcher is adjusted to generate specific flow rates of the etching gas corresponding to the plasma beams.
- The emitted light produced by the plasma discharge is monitored to calibrate the flow rate controller based on the flow rates and the corresponding emitted light.
- This calibration ensures efficient and precise control of the plasma beam in the plasma etcher.
Key Features and Innovation:
- Precise control of plasma beams in a plasma etcher.
- Monitoring emitted light to calibrate flow rate controller.
- Optimization of flow rates for efficient plasma etching processes.
Potential Applications: The technology can be applied in semiconductor manufacturing, microelectronics, and other industries that require precise plasma etching processes.
Problems Solved: The technology addresses the need for accurate control and calibration of plasma beams in plasma etching systems, leading to improved process efficiency and quality.
Benefits:
- Enhanced control and precision in plasma etching processes.
- Improved process efficiency and quality.
- Reduction in wastage of etching gas.
Commercial Applications: The technology can be utilized in semiconductor fabrication facilities, research institutions, and companies involved in microelectronics production. It can lead to cost savings, improved product quality, and increased productivity.
Questions about Plasma Beam Control: 1. How does monitoring emitted light help in calibrating the flow rate controller? 2. What are the potential implications of precise plasma beam control in semiconductor manufacturing?
Original Abstract Submitted
in a method of controlling a plasma beam of a plasma etcher a flow rate controller of the plasma etcher is set to generate one or more flow rates of an etching gas corresponding to one or more plasma beams of the plasma etcher. the emitted light generated by plasma discharge corresponding to the one or more plasma beams of the plasma etcher is monitored. the flow rate controller is calibrated based on the one or more flow rates and a corresponding emitted light of the plasma discharge.
