Taiwan semiconductor manufacturing company, ltd. (20240378361). SEMICONDUCTOR DEVICE LAYOUT simplified abstract
Contents
SEMICONDUCTOR DEVICE LAYOUT
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Jiann-Tyng Tzeng of Hsinchu (TW)
SEMICONDUCTOR DEVICE LAYOUT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240378361 titled 'SEMICONDUCTOR DEVICE LAYOUT
- Simplified Explanation:**
In some embodiments, portions of a pattern in an integrated circuit layer, such as metallic power lines in a power grid, are removed after the layout process through a computer-implemented process similar to solving the n-coloring problem.
- Key Features and Innovation:**
- Post-processing removal of pattern portions to reduce layer coverage in the integrated circuit. - Avoid harmful effects like severing power lines. - Analogous to solving the n-coloring problem. - Allows for precise control over the extent of pattern removal.
- Potential Applications:**
- Semiconductor manufacturing - Integrated circuit design - Power grid optimization
- Problems Solved:**
- Overlapping patterns in integrated circuits - Ensuring proper functionality of power lines - Minimizing fabrication errors
- Benefits:**
- Enhanced control over layer coverage - Improved efficiency in integrated circuit fabrication - Reduction of harmful effects in power grid design
- Commercial Applications:**
"Computer-Implemented Process for Post-Processing Removal of Pattern Portions in Integrated Circuits"
- Questions about Computer-Implemented Process for Post-Processing Removal of Pattern Portions in Integrated Circuits:**
1. How does the post-processing removal process improve the efficiency of integrated circuit fabrication? 2. What are the potential challenges in implementing this computer-implemented process in semiconductor manufacturing?
Original Abstract Submitted
in some embodiments, portions of a pattern, generated in a layout process, of a layer in an integrated circuit, such as those of a layer of metallic power lines in a power grid (pg), are removed after the layout process through a computer-implemented process analogous to solving the n-coloring problem. through this post-processing removal process, pattern portions can be removed so as reduce the coverage of the layer in the fabricated integrated circuit to a desired extent without producing certain harmful effects, such as severing a powerline.
