Taiwan semiconductor manufacturing company, ltd. (20240377755). MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS simplified abstract
Contents
MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240377755 titled 'MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS
Simplified Explanation: This patent application discusses a multiple-mask multiple-exposure lithographic technique using photomasks with die areas and stitching regions for integrated circuit fabrication.
Key Features and Innovation:
- Multiple-mask multiple-exposure lithographic technique
- Photomasks with die areas and stitching regions
- Stitching regions include mask features for circuit fabrication and alignment marks for overlay measurement
Potential Applications: This technology can be used in the semiconductor industry for the fabrication of integrated circuits with high precision and accuracy.
Problems Solved: This technology addresses the need for improved lithographic techniques in semiconductor manufacturing to achieve finer features and better alignment.
Benefits:
- Enhanced precision in integrated circuit fabrication
- Improved overlay measurement for better alignment
- Increased efficiency in lithographic processes
Commercial Applications: The technology can be applied in the production of advanced electronic devices, such as smartphones, computers, and other semiconductor-based products, to improve performance and reliability.
Prior Art: Readers can explore prior art related to multiple-exposure lithographic techniques, photomask design, and semiconductor manufacturing processes to understand the evolution of this technology.
Frequently Updated Research: Stay informed about the latest advancements in lithographic techniques, photomask technology, and semiconductor manufacturing processes to enhance your knowledge of this field.
Questions about Multiple-Mask Multiple-Exposure Lithographic Technique: 1. What are the key advantages of using multiple masks and exposures in lithographic processes? 2. How does the stitching region in a photomask contribute to the alignment and accuracy of integrated circuit features?
Original Abstract Submitted
examples of a multiple-mask multiple-exposure lithographic technique and suitable masks are provided herein. in some examples, a photomask includes a die area and a stitching region disposed adjacent to the die area and along a boundary of the photomask. the stitching region includes a mask feature for forming an integrated circuit feature and an alignment mark for in-chip overlay measurement.
