Taiwan semiconductor manufacturing company, ltd. (20240377595). PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME simplified abstract
Contents
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Jiun Yi Wu of Zhongli City (TW)
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240377595 titled 'PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
The method described in the abstract involves the formation of a package containing an optical die and a protection layer attached to the optical die, with a micro lens included in the optical die. The protection layer and the micro lens are on the same side of the optical die. The package is then encapsulated in an encapsulant, planarized to reveal the protection layer, and the protection layer is removed to create a recess in the encapsulant. The optical die is positioned beneath the recess, with the micro lens facing the recess.
- Package formation with optical die and protection layer
- Inclusion of micro lens in the optical die
- Encapsulation of the package in an encapsulant
- Planarization of the encapsulant to reveal the protection layer
- Removal of the protection layer to form a recess with the micro lens facing it
Potential Applications: - Optical devices - Imaging systems - Sensor technology
Problems Solved: - Protection of optical components - Enhanced optical performance - Improved durability
Benefits: - Increased optical clarity - Enhanced protection for delicate components - Improved overall device performance
Commercial Applications: Title: Advanced Optical Packaging Technology for Enhanced Device Performance This technology can be utilized in various industries such as consumer electronics, automotive, medical devices, and telecommunications for improved optical performance and durability.
Questions about the technology: 1. How does the presence of the micro lens impact the optical performance of the device? 2. What are the potential cost implications of implementing this advanced optical packaging technology?
Original Abstract Submitted
a method includes forming a package, which includes an optical die and a protection layer attached to the optical die. the optical die includes a micro lens, with the protection layer and the micro lens being on a same side of the optical die. the method further includes encapsulating the package in an encapsulant, planarizing the encapsulant to reveal the protection layer, and removing the protection layer to form a recess in the encapsulant. the optical die is underlying the recess, with the micro lens facing the recess.
