Taiwan semiconductor manufacturing company, ltd. (20240377587). PACKAGED DEVICE WITH OPTICAL PATHWAY simplified abstract

PACKAGED DEVICE WITH OPTICAL PATHWAY

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu (TW)

Ming-Fa Chen of Taichung City (TW)

PACKAGED DEVICE WITH OPTICAL PATHWAY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240377587 titled 'PACKAGED DEVICE WITH OPTICAL PATHWAY

The abstract of the patent application describes a packaged device that includes an optical IC with an optical feature. An interconnect structure with conductive features embedded in dielectric materials overlays the optical feature. The structure is patterned to remove it from the optical feature, and a dielectric material with optically neutral properties is formed over the feature. Electronic ICs can be bonded to the optical IC to create an integrated package.

• Optical IC with embedded optical feature
• Interconnect structure with conductive features and dielectric materials
• Patterning to remove structure from optical feature
• Dielectric material with optically neutral properties
• Bonding of electronic ICs to optical IC for integrated package

Potential Applications: - Optical communication devices - Integrated circuit packaging - Optical sensors

Problems Solved: - Protecting optical features during packaging - Ensuring optical neutrality of materials - Facilitating integration of electronic and optical components

Benefits: - Enhanced optical performance - Improved reliability of integrated packages - Simplified manufacturing processes

Commercial Applications: Title: Integrated Optical IC Packaging for Enhanced Performance This technology can be used in the development of advanced optical communication devices, integrated circuit packaging solutions, and optical sensors, catering to industries such as telecommunications, electronics, and healthcare.

Prior Art: Researchers can explore prior patents related to integrated optical packaging, dielectric materials with optical properties, and interconnect structures in semiconductor devices.

Frequently Updated Research: Researchers are continually exploring new materials and manufacturing techniques to improve the performance and reliability of integrated optical packages.

Questions about Integrated Optical IC Packaging: 1. How does the optically neutral dielectric material enhance the performance of the optical IC? 2. What are the key challenges in bonding electronic ICs to optical ICs in integrated packages?

Original Abstract Submitted

a packaged device includes an optical ic having an optical feature therein. an interconnect structure including layers of conductive features embedded within respective layers of dielectric materials overlie the optical feature. the interconnect structure is patterned to remove the interconnect structure from over the optical feature and a dielectric material having optically neutral properties, relative to a desired light wavelength(s) is formed over the optical feature. one or more electronic ics may be bonded to the optical ic to form an integrated package.