Taiwan semiconductor manufacturing company, ltd. (20240377364). Acoustic Measurement of Fabrication Equipment Clearance simplified abstract
Contents
Acoustic Measurement of Fabrication Equipment Clearance
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Yu-Ching Lee of Kaohsiung City (TW)
Sheng-Chi Chin of Hsinchu City (TW)
Acoustic Measurement of Fabrication Equipment Clearance - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240377364 titled 'Acoustic Measurement of Fabrication Equipment Clearance
Simplified Explanation: The patent application describes a method and system that uses acoustic energy to determine the gap between a wafer and an integrated circuit processing system, as well as the thickness of a material layer on the wafer during IC processing.
- Acoustic energy is emitted through a substrate and material layer, with reflected energy indicating the thickness of the material layer.
- The method involves converting the reflected acoustic energy into electrical signals to determine the material layer's thickness accurately.
Key Features and Innovation:
- Use of acoustic energy to measure the gap and thickness in IC processing.
- Accurate determination of material layer thickness through reflected acoustic energy.
- Integration of acoustic technology into IC processing systems for improved precision.
Potential Applications: The technology can be applied in semiconductor manufacturing, wafer processing, and IC fabrication processes.
Problems Solved:
- Accurate measurement of material layer thickness during IC processing.
- Improved gap detection between wafer and IC processing system components.
Benefits:
- Enhanced precision in IC processing.
- Reduction in material wastage during manufacturing.
- Improved quality control in semiconductor production.
Commercial Applications:
- Title: "Acoustic Energy Measurement System for IC Processing"
- Potential commercial uses include semiconductor manufacturing, wafer processing, and IC fabrication.
- Market implications include increased efficiency and accuracy in IC production processes.
Prior Art: Readers can explore prior research on acoustic energy applications in semiconductor manufacturing and IC processing to understand the technology's evolution.
Frequently Updated Research: Stay updated on advancements in acoustic technology for IC processing and semiconductor manufacturing to leverage the latest innovations in the field.
Questions about Acoustic Energy Measurement System for IC Processing: 1. How does the use of acoustic energy improve the accuracy of material layer thickness measurement in IC processing? 2. What are the potential challenges in implementing acoustic energy technology in semiconductor manufacturing processes?
Original Abstract Submitted
methods and systems disclosed herein use acoustic energy to determine a gap between a wafer and an integrated circuit (ic) processing system and/or determine a thickness of a material layer of the wafer during ic processing implemented by the ic processing system. an exemplary method includes emitting acoustic energy through a substrate and a material layer disposed thereover. the substrate is positioned within an ic processing system. the method further includes receiving reflected acoustic energy from a surface of the substrate and a surface of the material layer disposed thereover and converting the reflected acoustic energy into electrical signals. the electrical signals indicate a thickness of the material layer.
