Taiwan semiconductor manufacturing company, ltd. (20240376600). METHODS OF SUBSTRATE PROCESSING AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
METHODS OF SUBSTRATE PROCESSING AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Tsung-Cheng Wu of Hsinchu (TW)
Ming-Hsien Lin of Taichung City (TW)
METHODS OF SUBSTRATE PROCESSING AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240376600 titled 'METHODS OF SUBSTRATE PROCESSING AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
The abstract describes an assembly consisting of a cover ring with a rough first surface and a deposition ring with a different roughness on its first surface.
- The assembly includes a cover ring with a first rough surface and a deposition ring with a second rough surface.
- The first roughness on the cover ring is distinct from the second roughness on the deposition ring.
- The cover ring and deposition ring are positioned such that their rough surfaces face each other.
Potential Applications: - This technology could be used in precision engineering applications where surface roughness plays a critical role. - It may find applications in the manufacturing of components where controlled surface textures are required.
Problems Solved: - Provides a method to control and manipulate surface roughness in assemblies. - Offers a solution for achieving specific surface characteristics in a controlled manner.
Benefits: - Enables precise control over surface roughness in assemblies. - Facilitates the production of components with tailored surface textures.
Commercial Applications: Title: Precision Engineering Solutions for Controlled Surface Roughness This technology could be utilized in industries such as aerospace, automotive, and medical devices where precise surface characteristics are essential for performance and reliability.
Questions about the technology: 1. How does the different roughness levels on the cover ring and deposition ring impact the overall performance of the assembly?
- The varying roughness levels allow for specific surface characteristics to be achieved, enhancing the functionality of the assembly.
2. What are the potential cost implications of implementing this technology in manufacturing processes?
- The cost implications would depend on the scale of production and the materials used, but the technology could potentially lead to more efficient manufacturing processes.
Original Abstract Submitted
an assembly includes a cover ring having a first surface and a second surface opposite the first surface, the first surface of the cover ring having a first roughness, and a deposition ring having a first surface facing the cover ring and a second surface opposite the first surface, the first surface of the deposition ring having a second roughness. the first roughness is different from the second roughness.
