Taiwan semiconductor manufacturing company, ltd. (20240375939). STOPPER BUMP STRUCTURES FOR MEMS DEVICE simplified abstract
Contents
STOPPER BUMP STRUCTURES FOR MEMS DEVICE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wei-Jhih Mao of Taipei City (TW)
Shang-Ying Tsai of Pingzhen City (TW)
Kuei-Sung Chang of Kaohsiung City (TW)
Chun-Wen Cheng of Zhubei City (TW)
STOPPER BUMP STRUCTURES FOR MEMS DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240375939 titled 'STOPPER BUMP STRUCTURES FOR MEMS DEVICE
Simplified Explanation: The patent application describes an integrated chip (IC) with adhesive structures and a microelectromechanical systems (MEMS) structure.
- The IC includes a substrate with adhesive structures.
- A MEMS structure, with a movable element in a cavity, is placed on the adhesive structures.
- Stopper bumps are positioned between the movable element and the substrate.
Key Features and Innovation:
- Integration of adhesive structures on a substrate for MEMS structures.
- Use of stopper bumps to enhance the functionality of the MEMS structure.
Potential Applications:
- MEMS sensors in consumer electronics.
- MEMS actuators in automotive systems.
- MEMS switches in telecommunications.
Problems Solved:
- Improved stability and performance of MEMS structures.
- Enhanced adhesion between MEMS components and the substrate.
Benefits:
- Higher reliability of MEMS devices.
- Increased precision in MEMS operations.
- Cost-effective manufacturing process.
Commercial Applications:
- MEMS-based sensors for IoT devices.
- MEMS actuators for robotics.
- MEMS switches for telecommunications networks.
Prior Art: Prior art related to this technology can be found in patents and research papers on MEMS structures and adhesive bonding techniques.
Frequently Updated Research: Ongoing research focuses on optimizing the design of MEMS structures for various applications and improving the reliability of adhesive bonding in ICs.
Questions about MEMS Structures: 1. How do MEMS structures differ from traditional electronic components? 2. What are the key challenges in manufacturing MEMS devices at scale?
Original Abstract Submitted
various embodiments of the present disclosure are directed towards an integrated chip (ic) including a substrate. a plurality of adhesive structures is disposed on the substrate. a microelectromechanical systems (mems) structure is disposed on the adhesive structures. the mems structure comprises a movable element disposed within a cavity. a first plurality of stopper bumps is disposed between the movable element and the substrate.
