Taiwan semiconductor manufacturing company, ltd. (20240375251). DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME simplified abstract
Contents
DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Jen-Yuan Chang of Hsinchu (TW)
DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240375251 titled 'DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME
Simplified Explanation: The die bonding system described in the patent application consists of a pick-and-placer, a carrier fixing platform, and a transfer platform. The pick-and-placer is equipped with a suction head to pick up a die and place it on a carrier. The carrier fixing platform is used to secure the carrier in place, which has a bearing surface facing downward or at an angle. The transfer platform includes a driver that controls the pick-and-placer to bond the die to the carrier's bearing surface.
- The system includes a pick-and-placer, carrier fixing platform, and transfer platform.
- The pick-and-placer has a suction head for picking up and placing a die on a carrier.
- The carrier fixing platform secures the carrier with a bearing surface facing downward or at an angle.
- The transfer platform has a driver that controls the pick-and-placer to bond the die to the carrier's bearing surface.
Potential Applications: - Semiconductor manufacturing - Electronics assembly - Microelectronics industry
Problems Solved: - Efficient die bonding process - Precise placement of dies on carriers - Improved manufacturing productivity
Benefits: - Enhanced accuracy in die bonding - Increased production efficiency - Cost-effective manufacturing process
Commercial Applications: Title: Advanced Die Bonding System for Semiconductor Industry This technology can be utilized in semiconductor manufacturing facilities to streamline the die bonding process, leading to higher productivity and cost savings. The system's precise placement capabilities make it ideal for use in the microelectronics industry.
Prior Art: Readers interested in prior art related to this technology may explore patents in the field of semiconductor manufacturing equipment and die bonding systems.
Frequently Updated Research: Researchers in the field of microelectronics and semiconductor manufacturing may be conducting studies on advancements in die bonding technology and its impact on production efficiency.
Questions about Die Bonding Systems: 1. How does the angle of the carrier's bearing surface affect the die bonding process? - The angle of the carrier's bearing surface can impact the alignment and adhesion of the die during bonding, influencing the overall quality of the assembly. 2. What are the key differences between traditional die bonding systems and the innovative system described in the patent application? - The innovative die bonding system offers improved precision, efficiency, and control over the bonding process compared to traditional systems.
Original Abstract Submitted
a die bonding system includes a pick-and-placer, a carrier fixing platform and a transfer platform. the pick-and-placer includes a suction head for picking up a die and placing the die on a carrier. the carrier fixing platform is used to fix the carrier. the carrier has a bearing surface arranged to face downward or to be inclined at an angle relative to a horizontal plane. the transfer platform includes a driver, the pick-and-placer is arranged on the transfer platform, and the driver controls the pick-and-placer to move to a location under the carrier or tilt the angle relative to the horizontal plane, and the pick-and-placer bonds the die to the bearing surface of the carrier from a location under the carrier or at the angle of tilt.
