Taiwan semiconductor manufacturing company, ltd. (20240375236). SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES simplified abstract
Contents
SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chun-Wei Chang of Hsinchu (TW)
Ming-Fa Chen of Taichung City (TW)
Chao-Wen Shih of Zhubei City (TW)
SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240375236 titled 'SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES
Simplified Explanation: The method described in the patent application involves bonding a package component on a composite carrier and then performing multiple polishing processes to remove layers of the composite carrier, stopping at specific layers within the carrier.
- The method involves bonding a first package component on a composite carrier.
- A first polishing process is performed to remove the base carrier of the composite carrier, stopping on a first layer.
- A second polishing process removes the first layer of the composite carrier, stopping on a second layer.
- A third polishing process removes multiple layers in the composite carrier, including the second layer, stopping on a dielectric layer in the first package component.
Key Features and Innovation:
- Multi-step polishing process to remove layers of a composite carrier.
- Precise stopping points at specific layers within the composite carrier.
- Efficient removal of layers without damaging the package component.
Potential Applications:
- Semiconductor manufacturing
- Microelectronics industry
- Integrated circuit packaging
Problems Solved:
- Efficient removal of layers in a composite carrier
- Precision polishing process for delicate components
- Minimizing damage during carrier removal
Benefits:
- Improved manufacturing processes
- Enhanced product quality
- Cost-effective production methods
Commercial Applications: The technology described in this patent application could be used in the semiconductor industry for the precise manufacturing of integrated circuits, leading to improved product quality and cost-effective production methods.
Questions about the Technology: 1. How does the multi-step polishing process improve the manufacturing of semiconductor components? 2. What are the potential cost savings associated with using this technology in the microelectronics industry?
Original Abstract Submitted
a method includes bonding a first package component on a composite carrier, and performing a first polishing process on the composite carrier to remove a base carrier of the composite carrier. the first polishing process stops on a first layer of the composite carrier. a second polishing process is performed to remove the first layer of the composite carrier. the second polishing process stops on a second layer of the composite carrier. a third polishing process is performed to remove a plurality of layers in the composite carrier. the plurality of layers include the second layer, and the third polishing process stops on a dielectric layer in the first package component.
