BAE SYSTEMS Information and Electronic Systems Integration Inc. (20240381565). ADDITIVE MANUFACTURING COMPATIBLE LIQUID-COOLED PCB CHASSIS simplified abstract
Contents
ADDITIVE MANUFACTURING COMPATIBLE LIQUID-COOLED PCB CHASSIS
Organization Name
BAE SYSTEMS Information and Electronic Systems Integration Inc.
Inventor(s)
Richard E. Berkenbush of Pompton Plains NJ (US)
Robert E. Scholl of Morristown NJ (US)
Meredith T. Thanos of Morris Plains NJ (US)
Robert S. Foster of Wharton NJ (US)
ADDITIVE MANUFACTURING COMPATIBLE LIQUID-COOLED PCB CHASSIS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240381565 titled 'ADDITIVE MANUFACTURING COMPATIBLE LIQUID-COOLED PCB CHASSIS
Simplified Explanation:
The patent application describes a method of manufacturing a liquid-cooled printed circuit board chassis using 3D printing and subtractive manufacturing techniques, without the need for brazing or heat application. The chassis includes horizontal cooling channels that are 3D printed within the components and divided into subchannels by internal walls functioning as thermal baffles.
Key Features and Innovation:
- Liquid-cooled printed circuit board chassis manufactured without brazing
- 3D printing and subtractive manufacturing techniques used
- Horizontal cooling channels with thermal baffles for efficient cooling
- Elastomer seals for connecting cooling channels
- EMI seals formed by EMI gaskets
- Alignment pins for component alignment
- Bolts, screws, and adhesives for joining components
- Intermediate horizontal extension for shorter printed circuit boards
Potential Applications: The technology can be applied in various industries requiring efficient cooling systems for printed circuit boards, such as telecommunications, aerospace, and automotive.
Problems Solved: The technology addresses the need for a cost-effective and efficient method of manufacturing liquid-cooled printed circuit board chassis without the use of heat-intensive processes like brazing.
Benefits:
- Cost-effective manufacturing process
- Efficient cooling system for printed circuit boards
- Versatile applications across different industries
Commercial Applications: "Efficient Liquid-Cooled Printed Circuit Board Chassis Manufacturing Method for Various Industries"
Prior Art: Prior art related to this technology may include patents or research papers on liquid-cooled printed circuit board chassis manufacturing methods using 3D printing and subtractive manufacturing techniques.
Frequently Updated Research: Researchers may be exploring advancements in 3D printing materials and techniques for improving the efficiency of liquid-cooled printed circuit board chassis.
Questions about Liquid-Cooled Printed Circuit Board Chassis Manufacturing: 1. How does the use of thermal baffles improve the cooling efficiency of the chassis? 2. What are the potential challenges in aligning and assembling the components of the chassis without the application of heat?
Original Abstract Submitted
a liquid-cooled printed circuit board chassis, such as a eurocard chassis, is manufactured without brazing by 3d printing a plurality of components, smoothing and completing the components by subtractive manufacture, and then aligning and assembling the final chassis, all without application of heat. horizontal cooling channels 3d printed within the chassis components are in thermal contact with board slots, and are divided into subchannels by closely spaced internal walls that function as thermal baffles. the baffles are tilted at oblique angles to increase their cooling efficiency, and to enable am manufacture without temporary support structures. elastomer seals between components can connect the cooling channels to vertical connecting channels. emi seals can be formed between the components by emi gaskets. the components can be aligned by alignment pins, and joined together by bolts, screws, and/or adhesives. an intermediate horizontal extension can be included to accommodate shorter printed circuit boards.
