CMC Materials LLC (20240376238). DUAL-CURE RESIN FOR PREPARING CHEMICAL MECHANICAL POLISHING PADS simplified abstract
Contents
DUAL-CURE RESIN FOR PREPARING CHEMICAL MECHANICAL POLISHING PADS
Organization Name
Inventor(s)
Achla Khanna of Naperville IL (US)
DUAL-CURE RESIN FOR PREPARING CHEMICAL MECHANICAL POLISHING PADS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240376238 titled 'DUAL-CURE RESIN FOR PREPARING CHEMICAL MECHANICAL POLISHING PADS
Simplified Explanation: The patent application describes a dual-cure resin formulation with an improved pot life for fabricating a CMP pad using 3D printing.
Key Features and Innovation:
- Dual-cure resin formulation
- Improved pot life
- Fabrication of CMP pad using 3D printing process
Potential Applications: The technology can be used in the semiconductor industry for manufacturing CMP pads used in the wafer polishing process.
Problems Solved: The technology addresses the issue of short pot life in dual-cure resin formulations, allowing for more efficient fabrication processes.
Benefits: The technology enables longer working times, leading to increased productivity and cost savings in manufacturing processes.
Commercial Applications: The technology can be applied in semiconductor manufacturing facilities to improve the efficiency of CMP pad fabrication processes, potentially reducing production costs and enhancing overall productivity.
Questions about Dual-Cure Resin Formulation: 1. What are the key benefits of using a dual-cure resin formulation in CMP pad fabrication? 2. How does the improved pot life of the resin formulation impact the manufacturing process efficiency?
Frequently Updated Research: Stay updated on the latest advancements in dual-cure resin formulations for semiconductor manufacturing applications to ensure optimal utilization of this technology.
Original Abstract Submitted
a dual-cure resin formulation having an improved pot life is described. the dual cure resin may be used to fabricate a cmp pad using a 3d printing process.
