Samsung electronics co., ltd. (20240381624). SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about Semiconductor Device Manufacturing
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240381624 titled 'SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF
Simplified Explanation
The patent application describes a method for manufacturing a semiconductor device, involving the formation of word lines and bit lines on a substrate.
- The method includes connecting the ends of the word lines, forming a separation groove with an insulating layer, and creating the bit lines on the substrate.
Key Features and Innovation
- Formation of first and second word lines on a substrate.
- Connection of the ends of the word lines.
- Creation of a separation groove with an insulating layer.
- Formation of first and second bit lines on the substrate.
Potential Applications
This technology can be used in the manufacturing of various semiconductor devices, such as memory chips, processors, and sensors.
Problems Solved
- Efficient manufacturing of semiconductor devices.
- Improved connectivity between word lines.
- Enhanced insulation with the separation groove.
Benefits
- Increased performance and reliability of semiconductor devices.
- Cost-effective manufacturing process.
- Enhanced functionality and integration of components.
Commercial Applications
- Memory chip manufacturing industry.
- Semiconductor device production companies.
- Electronics and technology sectors.
Questions about Semiconductor Device Manufacturing
1. How does the formation of separation grooves improve the performance of semiconductor devices?
The separation grooves with insulating layers help prevent interference between the word lines and bit lines, leading to better overall functionality and reliability.
2. What are the key advantages of connecting the ends of word lines in semiconductor device manufacturing?
Connecting the ends of word lines ensures a more stable and efficient flow of data within the device, enhancing its performance and longevity.
Original Abstract Submitted
an embodiment provides a manufacturing method of a semiconductor device, including: forming first and second word lines in a substrate, wherein respective ends of the first and second word lines are connected to each other; forming a first separation groove between the first word line and the second word line, wherein the first separation groove includes a first insulating layer; and forming first and second bit lines on the substrate.
