Samsung electronics co., ltd. (20240381523). ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL simplified abstract
Contents
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
Organization Name
Inventor(s)
Kiyeong Jeong of Suwon-si (KR)
Nurimaka Jung of Suwon-si (KR)
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240381523 titled 'ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
Simplified Explanation: The patent application describes an electronic device with a thermal interface material between the printed circuit board and a shield can to improve heat dissipation.
Key Features and Innovation:
- Electronic device with a printed circuit board and through hole
- Electronic component on the printed circuit board
- Shield can covering the electronic component
- Thermal interface material between the printed circuit board and shield can for heat dissipation
- Opening connecting the space between the printed circuit board and shield can to an external space
Potential Applications: This technology can be used in various electronic devices where heat dissipation is crucial, such as computers, smartphones, and other consumer electronics.
Problems Solved: This technology addresses the issue of heat buildup in electronic devices, which can lead to performance degradation and component damage.
Benefits:
- Improved heat dissipation
- Enhanced performance and longevity of electronic components
- Reduction of heat-related issues in electronic devices
Commercial Applications: Potential commercial applications include the manufacturing of electronic devices, particularly those that require efficient heat management for optimal performance.
Prior Art: Readers can explore prior art related to thermal interface materials, heat dissipation techniques, and electronic device cooling systems to understand the background of this technology.
Frequently Updated Research: Stay updated on the latest research in thermal management technologies, electronic cooling systems, and advancements in heat dissipation methods for electronic devices.
Questions about Thermal Interface Materials: 1. What are the different types of thermal interface materials available in the market, and how do they compare in terms of performance and cost? 2. How does the use of thermal interface materials impact the overall design and efficiency of electronic devices?
Original Abstract Submitted
an electronic device is provided. the electronic device includes a printed circuit board including a through hole, an electronic component disposed on the printed circuit board, a shield can covering the electronic component, and a thermal interface material (tim) included in a space between the printed circuit board and the shield can. the thermal interface material occupies a space between a surface of the electronic component and the shield can, and contacts the first electronic component. a space between the printed circuit board and the shield can is connected to an external space of the shield can through an opening.
