Samsung electronics co., ltd. (20240379923). DISPLAY APPARATUS COMPRISING DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME simplified abstract

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DISPLAY APPARATUS COMPRISING DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

Jonghoon Jung of Suwon-si (KR)

Jinyoung Kim of Suwon-si (KR)

Sungyong Min of Suwon-si (KR)

Changjoon Lee of Suwon-si (KR)

DISPLAY APPARATUS COMPRISING DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379923 titled 'DISPLAY APPARATUS COMPRISING DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME

The abstract describes a display module that includes a substrate with a pad electrode, an inorganic light emitting element with a contact electrode, a bump for bonding the electrodes, a reflective member to underfill and reflect light, and a cover member with a black color.

  • Substrate with pad electrode
  • Inorganic light emitting element with contact electrode
  • Bump for bonding electrodes
  • Reflective member to underfill and reflect light
  • Cover member with black color

Potential Applications: - Display screens - Lighting fixtures - Electronic devices

Problems Solved: - Enhancing light reflection - Improving display quality - Securing electrode connections

Benefits: - Enhanced brightness - Improved durability - Sleek design

Commercial Applications: - Consumer electronics - Automotive displays - Signage industry

Questions about the technology: 1. How does the reflective member improve light emission efficiency? 2. What materials are used in the bump for bonding electrodes?

Frequently Updated Research: - Ongoing studies on enhancing light emission in display technologies.


Original Abstract Submitted

a display module includes: a substrate including a mounting surface and a pad electrode on the mounting surface; an inorganic light emitting element including a contact electrode corresponding to the pad electrode; a bump disposed between the pad electrode and the contact electrode to bond the pad electrode and the contact electrode, the bump being electrically connecting the pad electrode to the contact electrode; a reflective member configured to underfill the inorganic light emitting element to cover side surfaces of the inorganic light emitting element and a bottom surface of the inorganic light emitting element, and configured to reflect light; and a cover member configured to cover side surfaces of the reflective member and the mounting surface of the substrate, the cover member having a black color.