Samsung electronics co., ltd. (20240379620). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379620 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation: The semiconductor package described in the patent application includes a package substrate with two semiconductor chips arranged on it. The second semiconductor chip is placed on top of the first chip using an adhesive film, with a stress-relieving adhesive layer covering the first chip's upper surface and extending vertically downward to cover a side surface under an overhang region of the second chip. A molding member then covers both chips on the package substrate.
- The semiconductor package includes a stress-relieving adhesive layer to reduce stress on the first semiconductor chip.
- The second semiconductor chip is offset-aligned with the first chip in a horizontal direction.
- An adhesive film is used to attach the second semiconductor chip to the first chip.
- A molding member covers both chips on the package substrate.
- The stress-relieving adhesive layer extends vertically downward to cover a side surface of the first semiconductor chip.
Potential Applications: This technology could be used in various semiconductor packaging applications where stress relief and precise alignment of chips are crucial, such as in microelectronics, consumer electronics, and automotive electronics.
Problems Solved: This technology addresses the issue of stress buildup in semiconductor chips during packaging, which can lead to performance degradation and reliability issues. It also ensures accurate alignment of chips for optimal functionality.
Benefits: - Improved reliability of semiconductor packages - Enhanced performance of semiconductor chips - Precise alignment of multiple chips in a package - Reduced risk of damage during handling and operation
Commercial Applications: The technology described in the patent application could have significant commercial applications in the semiconductor industry, particularly in the development of advanced electronic devices, automotive systems, and communication technologies.
Prior Art: While specific prior art related to this technology is not provided in the abstract, researchers and industry professionals may explore existing patents and publications in the field of semiconductor packaging, stress relief techniques, and chip alignment methods for further insights.
Frequently Updated Research: Researchers and engineers in the semiconductor industry are continuously exploring new materials and techniques to improve the performance and reliability of semiconductor packages. Stay updated on the latest advancements in stress relief and chip alignment technologies for semiconductor devices.
Questions about Semiconductor Packaging: 1. What are the key challenges in semiconductor packaging that this technology aims to address? 2. How does the stress-relieving adhesive layer contribute to the overall performance and reliability of the semiconductor package?
Original Abstract Submitted
a semiconductor package includes a package substrate. a first semiconductor chip is arranged on the package substrate. a second semiconductor chip is disposed on the first semiconductor chip by an adhesive film. the second semiconductor chip is offset-aligned with the first semiconductor chip in a horizontal direction. a stress relieving adhesive layer is disposed on the first semiconductor chip and covers an upper surface of the first semiconductor chip. the stress relieving adhesive layer extends vertically downward from the upper surface to cover a side surface of the first semiconductor chip under an overhang region of the second semiconductor chip. a molding member covers the first semiconductor chip and the second the semiconductor chip on the package substrate.
