Samsung electronics co., ltd. (20240379604). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379604 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
The semiconductor structure described in the patent application includes an insulation layer surrounding side surfaces of vias and connection pads on the vias, a first insulation member with through openings for the connection pads, and a second insulation member surrounding the first insulation member. The height of the second insulation member is lower than the heights of the connection pads, and the outermost through openings have inner side surfaces defined by the first and second insulation members.
- Insulation layer surrounds vias and connection pads, with first and second insulation members.
- Connection pads are on vias and in through openings in the first insulation member.
- Second insulation member is lower in height than connection pads.
- Outermost through openings have inner side surfaces defined by insulation members.
Potential Applications: - This technology could be used in the manufacturing of semiconductor devices to improve insulation and protection of connection pads. - It may find applications in the electronics industry for creating more efficient and reliable circuitry.
Problems Solved: - Provides enhanced insulation and protection for connection pads on vias in semiconductor structures. - Helps in reducing the risk of short circuits and other electrical issues in electronic devices.
Benefits: - Improved reliability and performance of semiconductor devices. - Enhanced protection for delicate connection pads. - Potential for more compact and efficient circuit designs.
Commercial Applications: Title: Enhanced Insulation Technology for Semiconductor Devices This technology could be utilized in the production of various electronic devices such as smartphones, computers, and other consumer electronics. It could also be beneficial in industrial applications where reliable and efficient circuitry is essential.
Questions about Semiconductor Insulation Technology: 1. How does this technology improve the reliability of semiconductor devices? 2. What are the potential cost-saving benefits of using this insulation technology in electronic manufacturing processes?
Frequently Updated Research: Researchers are continually exploring new materials and techniques to further enhance the insulation and protection of connection pads in semiconductor structures. Stay updated on the latest advancements in this field to ensure optimal performance in electronic devices.
Original Abstract Submitted
a semiconductor structure may include an insulation layer surrounding side surfaces of vias, connection pads on the vias, respectively, a first insulation member on the insulation layer and including through openings in which the connection pads respectively are disposed, and a second insulation member on the insulation layer and surrounding the first insulation member. each corresponding connection pad among the plurality of connection pads may be on a corresponding via among the plurality of vias and in a corresponding through opening among the plurality of through openings. a height of the second insulation member may be lower than the heights of the connection pads. outermost through openings among the through openings may include a first inner side surface defined by a side surface of the first insulation member and a second inner side surface defined by a side surface of the second insulation member.
