Samsung electronics co., ltd. (20240379575). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379575 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a redistribution layer, a semiconductor chip positioned on the redistribution layer, and a molding layer that covers the sidewall of the semiconductor chip, as well as the top surface and sidewall of the redistribution layer. The sidewall of the redistribution layer is inclined in relation to the bottom surface of the redistribution layer, and the sidewall of the molding layer is spaced apart from the sidewall of the redistribution layer.
- The semiconductor package features a redistribution layer that is inclined with respect to its bottom surface.
- The molding layer covers the sidewall of the semiconductor chip and the top surface and sidewall of the redistribution layer.
- The sidewall of the molding layer is spaced apart from the sidewall of the redistribution layer.
Potential Applications: - This technology can be utilized in the manufacturing of advanced semiconductor packages for various electronic devices. - It can be applied in the development of high-performance integrated circuits.
Problems Solved: - Provides improved protection and insulation for semiconductor chips. - Enhances the overall durability and reliability of semiconductor packages.
Benefits: - Increased efficiency in semiconductor packaging processes. - Enhanced performance and longevity of electronic devices utilizing these semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be commercially used in the production of smartphones, tablets, laptops, and other consumer electronics to improve their overall performance and reliability.
Questions about Semiconductor Packaging Technology: 1. How does the inclined sidewall of the redistribution layer contribute to the overall functionality of the semiconductor package? - The inclined sidewall of the redistribution layer allows for better heat dissipation and electrical connectivity within the semiconductor package.
2. What are the potential cost implications of implementing this advanced semiconductor packaging technology? - While initial costs may be higher due to the complexity of the manufacturing process, the long-term benefits in terms of device performance and reliability outweigh the initial investment.
Original Abstract Submitted
a semiconductor package includes a redistribution layer, a semiconductor chip on the redistribution layer, and a molding layer covering a sidewall of the semiconductor chip and a top surface and a sidewall of the redistribution layer. the sidewall of the redistribution layer is inclined with respect to a bottom surface of the redistribution layer, and a sidewall of the molding layer is spaced apart from the sidewall of the redistribution layer.
