Samsung electronics co., ltd. (20240379545). SEMICONDUCTOR DEVICES simplified abstract
Contents
SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Jeong Wan Han of Suwon-si (KR)
Byungkeun Kim of Suwon-si (KR)
Young-Hoo Kim of Suwon-si (KR)
SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379545 titled 'SEMICONDUCTOR DEVICES
The semiconductor device described in the abstract consists of a substrate and a conductive structure on the substrate. The conductive structure includes a lower conductive pattern and an upper conductive pattern, with the upper pattern positioned on top of the lower pattern. Additionally, either the first side surface of the lower conductive pattern or the second side surface of the upper conductive pattern has a rough surface. The width of the lower surface of the upper conductive pattern in a parallel direction to the substrate is equal to or less than the width of the upper surface of the lower conductive pattern in the same direction.
- Lower conductive pattern
- Upper conductive pattern
- Rough surface on at least one side surface
- Specific width measurements of the conductive patterns
- Substrate as the base
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuits
Problems Solved: - Enhancing conductivity - Improving adhesion between layers - Increasing efficiency of semiconductor devices
Benefits: - Enhanced performance of semiconductor devices - Better reliability - Cost-effective manufacturing process
Commercial Applications: Title: "Innovative Semiconductor Device for Enhanced Performance" This technology can be utilized in the production of various electronic devices such as smartphones, computers, and automotive electronics, leading to improved functionality and durability in the market.
Questions about the technology: 1. How does the rough surface on the conductive patterns impact the overall performance of the semiconductor device? 2. What are the specific advantages of having the upper conductive pattern width equal to or less than the lower conductive pattern width in the device design?
Original Abstract Submitted
a semiconductor device comprising: a substrate; and a conductive structure on the substrate, wherein the conductive structure comprises: a lower conductive structure comprising a lower conductive pattern; and an upper conductive structure comprising an upper conductive pattern, wherein the upper conductive structure is on the lower conductive structure, wherein at least one of a first side surface of the lower conductive pattern or a second side surface of the upper conductive pattern comprises a rough surface, and wherein a first width of a lower surface of the upper conductive pattern in a first direction parallel to a lower surface of the substrate is substantially equal to or less than a second width of an upper surface of the lower conductive pattern in the first direction.
