Samsung electronics co., ltd. (20240379524). SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES simplified abstract
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SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES
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SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379524 titled 'SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES
The semiconductor package described in the abstract includes a substrate with a semiconductor chip and an electronic element connected to it.
- The substrate has a first surface and a second surface, with the semiconductor chip placed on the first surface.
- The substrate also features a first element pad, a second element pad, a first connection pillar, and a second connection pillar for connecting the electronic element.
- The electronic element is connected to both the first and second connection pillars.
Potential Applications: - This semiconductor package could be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a compact and efficient way to connect electronic elements to a semiconductor chip. - Enhances the overall performance and reliability of electronic devices.
Benefits: - Improved connectivity and functionality in electronic devices. - Increased durability and longevity of semiconductor packages.
Commercial Applications: - This technology could be valuable for semiconductor manufacturers, electronics companies, and research institutions looking to enhance their products' performance and reliability.
Questions about the Technology: 1. How does this semiconductor package improve the overall efficiency of electronic devices? 2. What sets this packaging technology apart from traditional methods of connecting electronic elements to semiconductor chips?
Original Abstract Submitted
an example semiconductor package includes: a substrate that includes a first surface and a second surface disposed in an opposite direction of the first surface; a semiconductor chip that is disposed at the first surface of the substrate; and an electronic element that is disposed at at least one surface of the substrate. the substrate includes a first element pad disposed at one surface of the at least one surface, a second element pad disposed at a same surface as the first element pad, a first connection pillar extending from the first element pad, a second connection pillar extending from the second element pad, and the electronic element is connected to the first connection pillar and the second connection pillar.
