Samsung electronics co., ltd. (20240379478). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Yeongkwon Ko of Hwaseong-si (KR)
Seunghun Shin of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379478 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
The semiconductor package described in the patent application includes a substrate, a semiconductor chip on the substrate, and a molding layer covering the sidewall of the semiconductor chip.
- The semiconductor chip has a circuit region and an edge region around the circuit region.
- A reforming layer is present on the edge region of the semiconductor chip, with its top surface coplanar with the top surface of the molding layer.
Potential Applications: - This technology can be used in the manufacturing of various electronic devices such as smartphones, tablets, and computers. - It can also be applied in the automotive industry for advanced driver assistance systems and in industrial automation for control systems.
Problems Solved: - Provides improved protection for the semiconductor chip. - Ensures better integration of the chip within the package.
Benefits: - Enhanced durability and reliability of electronic devices. - Improved performance of semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized by semiconductor manufacturers to produce high-quality electronic devices with improved functionality and longevity. It can also benefit companies in the consumer electronics, automotive, and industrial sectors looking to enhance the performance of their products.
Questions about Semiconductor Packaging Technology: 1. How does the reforming layer on the edge region of the semiconductor chip contribute to the overall performance of the package? 2. What are the potential cost implications of implementing this advanced semiconductor packaging technology in mass production processes?
Frequently Updated Research: Researchers are constantly exploring new materials and techniques to further enhance the performance and reliability of semiconductor packages. Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal device functionality.
Original Abstract Submitted
disclosed are semiconductor packages and/or methods of fabricating the same. the semiconductor package comprises a substrate, a semiconductor chip on the substrate, and a molding layer. the semiconductor chip includes a circuit region and an edge region around the circuit region. the molding layer covers a sidewall of the semiconductor chip. the semiconductor chip includes a reforming layer on the edge region. a top surface of the reforming layer is coplanar with a top surface of the molding layer.
