Samsung electronics co., ltd. (20240379427). SEMICONDUCTOR DEVICE simplified abstract

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SEMICONDUCTOR DEVICE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Il Sup Kim of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379427 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation: The semiconductor device described in the patent application utilizes an etch stop film to enhance performance and reliability. This film is part of a process that involves forming multiple layers on a substrate, creating a trench, and using wet etching processes to remove specific portions of the film.

  • An etch stop film is formed as a homogenous film on a substrate.
  • A trench is created in an interlayer insulating film using a hard mask pattern.
  • Portions of the etch stop film are removed at the bottom of the trench using wet etching processes.
  • The remaining etch stop film is removed to expose the lower wiring pattern.

Key Features and Innovation:

  • Utilization of an etch stop film to improve element performance and reliability.
  • Sequential formation of an etch stop film, interlayer insulating film, and hard mask pattern.
  • Precise removal of portions of the etch stop film using wet etching processes.
  • Exposing the lower wiring pattern for enhanced functionality.

Potential Applications: This technology can be applied in the semiconductor industry for the development of advanced devices with improved performance and reliability.

Problems Solved:

  • Enhancing element performance and reliability in semiconductor devices.
  • Providing a method for precise removal of specific film portions in device fabrication processes.

Benefits:

  • Improved performance and reliability of semiconductor devices.
  • Enhanced functionality through precise film removal techniques.

Commercial Applications: The technology can be utilized in the production of high-performance semiconductor devices for various industries, including electronics, telecommunications, and computing.

Questions about Semiconductor Device with Etch Stop Film: 1. How does the etch stop film contribute to the overall performance of the semiconductor device? 2. What are the specific advantages of using wet etching processes in removing portions of the etch stop film?

Frequently Updated Research: Stay informed about the latest advancements in semiconductor device fabrication techniques and materials to enhance the performance and reliability of electronic components.


Original Abstract Submitted

a semiconductor device capable of improving element performance and reliability uses an etch stop film formed as a homogenous film. an etch stop film, an interlayer insulating film, and a hard mask pattern are sequentially formed on a substrate. a trench is formed in the interlayer insulating film using the hard mask pattern that exposes a surface of a portion of the etch stop film at a bottom of the trench. at the bottom of the trench, the hard mask pattern and a first portion of the etch stop film are removed by using a first wet etching process. a remaining portion of the etch stop film at the bottom of the trench is removed to expose the lower wiring pattern by using a second wet etching process.