Samsung electronics co., ltd. (20240379386). SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME AND METHOD OF PROCESSING SUBSTATE USING THE SAME simplified abstract
SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME AND METHOD OF PROCESSING SUBSTATE USING THE SAME
Organization Name
Inventor(s)
Hyunwoong Hwang of Suwon-si (KR)
Kyung-Won Kang of Suwon-si (KR)
Dong-Wook Kim of Suwon-si (KR)
SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME AND METHOD OF PROCESSING SUBSTATE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379386 titled 'SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME AND METHOD OF PROCESSING SUBSTATE USING THE SAME
The patent application describes a substrate processing system that includes a cluster module with substrate processing devices, a load port for substrate loading, and a substrate cleaning device positioned between the cluster module and the load port. The substrate cleaning device is designed to clean the substrates processed in the substrate processing devices and consists of a substrate cleaner with a cleaning chuck to support the substrate and a cleaning nozzle to spray fluid towards the cleaning chuck.
- Cluster module with substrate processing devices
- Load port for substrate loading
- Substrate cleaning device between cluster module and load port
- Substrate cleaning device cleans processed substrates
- Substrate cleaner with cleaning chuck and cleaning nozzle
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production
Problems Solved: - Contamination of substrates during processing - Maintaining substrate cleanliness for quality output
Benefits: - Improved substrate quality - Enhanced manufacturing efficiency - Reduced downtime for cleaning processes
Commercial Applications: Title: "Advanced Substrate Processing System for Semiconductor Manufacturing" This technology can be used in semiconductor manufacturing facilities to streamline substrate cleaning processes, improve production efficiency, and enhance overall product quality. The market implications include increased productivity and cost savings for manufacturers.
Questions about the technology: 1. How does the substrate cleaning device contribute to the overall efficiency of the substrate processing system? 2. What are the specific advantages of using a cleaning chuck and cleaning nozzle in the substrate cleaner?
Frequently Updated Research: Researchers are constantly exploring new methods to enhance substrate cleaning processes in semiconductor manufacturing to further improve production efficiency and product quality. Stay updated on the latest advancements in substrate processing technology for potential future applications.
Original Abstract Submitted
a substrate processing system includes a cluster module having substrate processing devices, a load port through which a substrate is loaded, and a substrate cleaning device between the cluster module and the load port, the substrate cleaning device being configured to clean the substrate processed in the substrate processing devices, and the substrate cleaning device including a substrate cleaner having a cleaning chuck to support the substrate, and a cleaning nozzle configured to spray a fluid toward the cleaning chuck.
