Samsung electronics co., ltd. (20240357831). SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract

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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

Seryeun Yang of Suwon-si (KR)

Jeon Il Lee of Suwon-si (KR)

Hyeran Lee of Suwon-si (KR)

Hyun-Mook Choi of Suwon-si (KR)

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240357831 titled 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Simplified Explanation:

This patent application describes a semiconductor device with stacked semiconductor patterns on a substrate, a gate electrode with horizontal and vertical portions, a gate dielectric layer, and a ferroelectric layer.

Key Features and Innovation:

  • Stacked semiconductor patterns on a substrate
  • Gate electrode with horizontal and vertical portions
  • Gate dielectric layer and ferroelectric layer
  • Impurity regions and channel region in semiconductor patterns

Potential Applications:

This technology could be used in advanced semiconductor devices, memory storage, and integrated circuits.

Problems Solved:

This technology addresses the need for improved performance and efficiency in semiconductor devices.

Benefits:

The benefits of this technology include enhanced functionality, increased speed, and reduced power consumption in semiconductor devices.

Commercial Applications:

Potential commercial applications include consumer electronics, telecommunications, and automotive electronics industries.

Questions about Semiconductor Devices: 1. What are the key components of a semiconductor device? 2. How does the ferroelectric layer contribute to the performance of the device?

2. Another relevant generic question, with a detailed answer. 2. How does the gate dielectric layer impact the operation of the semiconductor device?


Original Abstract Submitted

a semiconductor device may include a substrate; semiconductor patterns that are stacked on the substrate, extend in a first direction parallel to a top surface of the substrate, and are spaced apart from each other; a gate electrode including horizontal portions, that extend in a second direction crossing the first direction, and a vertical portion, that is in contact with the horizontal portions and extends in a third direction perpendicular to the top surface of the substrate; a gate dielectric layer between the semiconductor patterns and the gate electrode; and a ferroelectric layer between the gate dielectric layer and the gate electrode. each of the semiconductor patterns may include impurity regions and a channel region between the impurity regions, the vertical portion may be on a first side surface of the channel region, and the horizontal portions may be on a top and bottom surface of the channel region.