Samsung electronics co., ltd. (20240357741). PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract
Contents
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Yeonkyung Chung of Suwon-si (KR)
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240357741 titled 'PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
Simplified Explanation: The electronic device described in the patent application consists of a housing and a printed circuit board with multiple insulation layers and conductive layers.
- The insulation layers include a first layer with a resin having a high glass transition temperature (Tg) and a filler with a specific content percentage, and a second layer with a glass fiber.
- The conductive layers are alternately stacked with the insulation layers on the printed circuit board.
Key Features and Innovation:
- Use of high Tg resin and filler in the first insulation layer for improved thermal performance.
- Incorporation of glass fiber in the second insulation layer for enhanced durability.
- Alternating arrangement of insulation and conductive layers for efficient circuit board design.
Potential Applications: The technology can be applied in various electronic devices such as smartphones, tablets, laptops, and IoT devices.
Problems Solved:
- Enhanced thermal performance and durability of the printed circuit board.
- Efficient design for electronic devices with stacked insulation and conductive layers.
Benefits:
- Improved reliability and longevity of electronic devices.
- Better heat dissipation and overall performance.
- Cost-effective manufacturing process.
Commercial Applications: Potential commercial applications include consumer electronics, industrial equipment, automotive systems, and telecommunications devices.
Questions about the Technology: 1. How does the use of high Tg resin and filler in the insulation layers impact the overall performance of the electronic device? 2. What are the specific advantages of incorporating glass fiber in the second insulation layer of the printed circuit board?
Original Abstract Submitted
an electronic device according to an embodiment of the disclosure may comprise: a housing and a printed circuit board disposed in the housing and comprising an alternately stacked plurality of insulation layers and plurality of conductive layers. the plurality of insulation layers may include at least one first insulation layer and at least one second insulation layer. the at least one first insulation layer may include a first insulator including a resin having a tg value of 200 degrees or more and a filler having a content of 50% to 70%. the at least one second insulation layer may include a second insulator including a glass fiber.
