Samsung electronics co., ltd. (20240355802). SEMICONDUCTOR PACKAGE simplified abstract
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SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355802 titled 'SEMICONDUCTOR PACKAGE
The abstract describes a three-dimensional integrated circuit structure consisting of a first semiconductor die and a second semiconductor die stacked on top of each other. The first semiconductor die contains through-silicon vias (TSV) and integrated stack capacitor (ISC) chips placed between the TSVs.
- The first semiconductor die includes a plurality of through-silicon vias (TSV).
- The first semiconductor die also contains a plurality of integrated stack capacitor (ISC) chips.
- Each ISC chip is positioned between adjacent TSVs among the plurality of through-silicon vias.
Potential Applications: - High-performance computing systems - Advanced electronic devices - Data storage solutions
Problems Solved: - Enhanced performance and efficiency in integrated circuits - Increased data processing speed - Improved reliability and durability of semiconductor devices
Benefits: - Higher integration density - Reduced power consumption - Enhanced signal transmission speed
Commercial Applications: Title: "Innovative Three-Dimensional Integrated Circuit Structure for Advanced Electronics" This technology can be utilized in various industries such as telecommunications, automotive, aerospace, and consumer electronics. It can revolutionize the design and functionality of electronic devices, leading to more compact and efficient products in the market.
Questions about the Three-Dimensional Integrated Circuit Structure: 1. How does the placement of ISC chips between TSVs improve the performance of the integrated circuit? 2. What are the potential challenges in manufacturing and scaling up this advanced semiconductor technology?
Frequently Updated Research: Researchers are continuously exploring new materials and design techniques to further optimize the performance and capabilities of three-dimensional integrated circuit structures. Stay updated on the latest advancements in semiconductor technology to leverage the full potential of this innovation.
Original Abstract Submitted
a three-dimensional integrated circuit structure includes: a first semiconductor die; and a second semiconductor die disposed on the first semiconductor die, wherein the first semiconductor die includes: a plurality of through-silicon vias (tsv); and a plurality of integrated stack capacitor (isc) chips, wherein each of the plurality of isc chips is disposed between adjacent through-silicon vias among the plurality of through-silicon vias.
