Samsung electronics co., ltd. (20240355798). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeonjeong Hwang of Suwons-si (KR)
Kyung Don Mun of Suwon-si (KR)
Kyoung Lim Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355798 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a complex structure with multiple layers and components, such as semiconductor structures, conductive posts, molding material, redistribution layer structures, and a heat dissipation structure. Additionally, a 3D solenoid inductor is integrated into the package, utilizing some of the conductive posts and redistribution lines.
- First semiconductor structure on a first redistribution layer structure
- First and second conductive posts next to different sides of the first semiconductor structure
- Molding material encapsulating the semiconductor structure and conductive posts
- Second redistribution layer structure on top of the molding material
- Second semiconductor structure on the second redistribution layer structure
- Heat dissipation structure on the second redistribution layer structure
- 3D solenoid inductor utilizing some of the conductive posts and redistribution lines
Potential Applications: - Advanced electronics manufacturing - High-performance computing - Aerospace and defense technology
Problems Solved: - Enhanced heat dissipation in semiconductor packages - Improved integration of complex components in a compact space
Benefits: - Increased efficiency and performance of electronic devices - Enhanced reliability and durability of semiconductor packages
Commercial Applications: Title: Advanced Semiconductor Packaging Solutions for High-Performance Electronics This technology could revolutionize the semiconductor packaging industry by offering more efficient and compact solutions for high-performance electronic devices. The market implications include increased demand for advanced packaging technologies in various industries such as telecommunications, automotive, and consumer electronics.
Questions about the technology: 1. How does the integration of a 3D solenoid inductor improve the functionality of the semiconductor package? 2. What are the specific advantages of using multiple redistribution layer structures in this semiconductor package design?
Original Abstract Submitted
a semiconductor package including a first semiconductor structure on a first redistribution layer structure; first conductive posts on the first redistribution layer structure and next to the first side of the first semiconductor structure; second conductive posts on the first redistribution layer structure and next to a second side opposite to the first side of the first semiconductor structure; a molding material molding the first semiconductor structure, the first conductive posts, and the second conductive posts on the first redistribution layer structure; a second redistribution layer structure on the molding material; a second semiconductor structure on the second redistribution layer structure; a heat dissipation structure on the second redistribution layer structure; and a 3d solenoid inductor including some of the second conductive posts, the redistribution lines at the uppermost of the first redistribution layer structure, and the redistribution lines at the lowermost of the second redistribution layer structure.
