Samsung electronics co., ltd. (20240355794). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Choongbin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355794 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
The semiconductor package described in the patent application consists of a redistribution layer structure, a semiconductor structure, a printed circuit board, a molding material, and a silicon interposer.
- The redistribution layer structure provides a platform for the semiconductor structure.
- The printed circuit board surrounds the side surface of the semiconductor structure and extends around it.
- The molding material encapsulates the semiconductor structure on the redistribution layer structure.
- The silicon interposer is positioned on the printed circuit board and the molding material.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can enhance the performance and reliability of semiconductor components in high-tech applications.
Problems Solved: - The technology addresses the need for efficient packaging solutions for semiconductor devices. - It improves thermal management and electrical connectivity in semiconductor packages.
Benefits: - Enhanced performance and reliability of semiconductor components. - Improved thermal management and electrical connectivity. - Increased efficiency in semiconductor packaging processes.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, tablets, and computers. It can also find applications in automotive electronics, aerospace systems, and industrial equipment.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the thermal management of semiconductor components? - The technology enhances thermal dissipation by efficiently transferring heat away from the semiconductor structure.
2. What are the key advantages of using a silicon interposer in semiconductor packaging? - The silicon interposer provides a stable platform for mounting semiconductor components and improves electrical connectivity.
Original Abstract Submitted
a semiconductor package may include: a redistribution layer structure; a semiconductor structure on the redistribution layer structure; a printed circuit board on the redistribution layer structure and extending around a side surface of the semiconductor structure; a molding material extending around the semiconductor structure on the redistribution layer structure; and a silicon interposer on the printed circuit board and the molding material.
