Samsung electronics co., ltd. (20240355780). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355780 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
The abstract of the patent application describes a semiconductor package with first and second structures, where the first structure includes a first semiconductor substrate with a first semiconductor device on its active surface, a first through via, a first protection layer, and a first pad. The second structure includes a second pad, and the first and second structures are bonded together with the first and second pads in contact.
- The semiconductor package includes first and second structures bonded together.
- The first structure has a first semiconductor substrate with a semiconductor device, a through via, a protection layer, and a pad.
- The second structure includes a pad that contacts the pad of the first structure.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can be applied in the production of high-performance electronic components.
Problems Solved: - Provides a reliable and efficient method for fabricating semiconductor packages. - Enhances the performance and durability of semiconductor devices.
Benefits: - Improved reliability and performance of semiconductor packages. - Enhanced functionality of electronic devices. - Cost-effective fabrication process.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Electronic Devices This technology can be utilized in the production of consumer electronics, telecommunications equipment, and automotive electronics, among other applications. The market implications include increased efficiency in electronic device manufacturing and improved product performance.
Prior Art: Readers can explore prior research on semiconductor packaging methods, materials, and technologies to gain a deeper understanding of the advancements in the field.
Frequently Updated Research: Researchers are constantly working on improving semiconductor packaging techniques to meet the growing demands of the electronics industry. Stay updated on the latest developments in semiconductor packaging technology to stay ahead in the field.
Questions about Semiconductor Packaging: 1. How does this semiconductor packaging technology compare to traditional methods? This technology offers improved performance and reliability compared to traditional packaging methods by providing better protection and connectivity for semiconductor devices.
2. What are the potential challenges in implementing this advanced semiconductor packaging technology? One potential challenge could be the initial investment required for transitioning to this new packaging method, as well as the need for specialized equipment and expertise.
Original Abstract Submitted
semiconductor packages and fabrication methods thereof are provided. a semiconductor package includes first and second structures. the first structure includes: a first semiconductor substrate that has an active surface on which a first semiconductor device is configured to be provided, and an inactive surface opposite to the active surface; a first through via that vertically penetrates the first semiconductor substrate and protrudes from the inactive surface of the first semiconductor substrate; a first protection layer that covers the inactive surface of the first semiconductor substrate and buries the first through via; and a first pad that penetrates at least a portion of the first protection layer and is coupled to the first through via. the second structure includes a second pad, the first structure and the second structure are bonded to each other, and the first pad and the second pad are in contact with each other.
