Samsung electronics co., ltd. (20240355779). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeonseok Lee of Pyeongtaek-si (KR)
Seokhyun Lee of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355779 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a redistribution substrate with a first semiconductor chip on one surface and external terminals on the other surface. There is a second semiconductor chip above the first one, with external connection members below it, and conductive pillars connecting them to the redistribution substrate. The second semiconductor chip includes a device layer, a wiring layer, and a redistribution layer on a semiconductor substrate.
- The wiring layer of the second semiconductor chip contains intermetallic dielectric layers, wiring lines, and a conductive pad connected to the uppermost wiring line.
- The redistribution layer of the second semiconductor chip consists of a first redistribution dielectric layer, a first redistribution pattern, and a second redistribution dielectric layer.
- The vertical distance between the semiconductor substrate and the conductive pillars is less than that between the first semiconductor chip and the external terminals.
Potential Applications: - Advanced semiconductor packaging technology for electronic devices - High-performance computing systems - Aerospace and defense applications
Problems Solved: - Improved electrical connectivity in semiconductor packages - Enhanced performance and reliability of electronic devices - Space-saving design for compact electronic systems
Benefits: - Increased efficiency and speed of electronic devices - Enhanced durability and longevity of semiconductor packages - Cost-effective manufacturing processes for advanced technology
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Electronic Devices This technology can be utilized in various industries such as consumer electronics, telecommunications, automotive, and medical devices. It offers a competitive edge in the market by providing high-performance and reliable semiconductor packages for a wide range of applications.
Prior Art: Readers can explore prior art related to semiconductor packaging technologies, advanced interconnect solutions, and semiconductor chip stacking methods to gain a deeper understanding of the innovation presented in this patent application.
Frequently Updated Research: Stay informed about the latest advancements in semiconductor packaging technologies, materials science, and microelectronics research to keep up with the evolving landscape of electronic devices and systems.
Questions about Semiconductor Packaging Technology: 1. How does this semiconductor packaging technology improve the performance of electronic devices? This technology enhances electrical connectivity and reliability, leading to increased efficiency and speed in electronic devices.
2. What are the potential challenges in implementing this advanced semiconductor packaging technology in commercial applications? The integration of complex semiconductor packaging processes and materials may pose challenges in mass production and cost-effectiveness.
Original Abstract Submitted
a semiconductor package includes a redistribution substrate having first and second surfaces, a first semiconductor chip on the first surface, external terminals on the second surface, a second semiconductor chip above the first semiconductor chip, external connection members below the second semiconductor chip, conductive pillars electrically connecting the external connection members to the redistribution substrate. the second semiconductor chip includes a device layer, a wiring layer, and a redistribution layer on a semiconductor substrate. the wiring layer includes intermetallic dielectric layers, wiring lines, and a conductive pad connected to an uppermost wiring line. the redistribution layer includes a first redistribution dielectric layer, a first redistribution pattern, and a second redistribution dielectric layer. a vertical distance between the semiconductor substrate and the conductive pillars is less than that between the first semiconductor chip and the external terminals.
