Samsung electronics co., ltd. (20240355770). SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
YOUNG-DEUK Kim of Suwon-si (KR)
HEEJUNG Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355770 titled 'SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
The semiconductor package described in the patent application consists of a first semiconductor chip with a second semiconductor chip placed on top of it. A bump structure is positioned between the two chips to establish an electrical connection. This bump structure includes a first bump pad and a second bump pad on the same plane, with a solder bump in between them, connecting the two pads.
- The semiconductor package includes a first semiconductor chip and a second semiconductor chip stacked on top of each other.
- A bump structure is placed between the chips to establish an electrical connection.
- The bump structure consists of a first bump pad, a second bump pad, and a solder bump connecting the two pads.
- The first and second bump pads are on the same plane, with the solder bump in between them.
- The solder bump abuts on the sides of both the first and second bump pads.
Potential Applications: - This technology can be used in various electronic devices requiring stacked semiconductor chips. - It can be applied in the manufacturing of compact and efficient electronic products.
Problems Solved: - Enables efficient electrical connection between stacked semiconductor chips. - Facilitates the design and production of compact electronic devices.
Benefits: - Improved electrical connectivity between semiconductor chips. - Enhanced efficiency in electronic device manufacturing. - Enables the development of smaller and more powerful electronic products.
Commercial Applications: Title: Semiconductor Package with Bump Structure for Enhanced Electrical Connectivity This technology can be utilized in the production of smartphones, tablets, laptops, and other compact electronic devices. It can also benefit the semiconductor industry by improving the design and manufacturing processes of electronic components.
Questions about Semiconductor Package with Bump Structure for Enhanced Electrical Connectivity: 1. How does the bump structure enhance the electrical connection between semiconductor chips? 2. What are the potential applications of this technology in the electronics industry?
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip. a second semiconductor chip is disposed on the first semiconductor chip. a bump structure is disposed between the first semiconductor chip and the second semiconductor chip. the bump structure electrically connects the first semiconductor chip and the second semiconductor chip to each other. the bump structure includes a first bump pad and a second bump pad disposed on a same plane as each other, and a solder bump disposed between the first bump pad and the second bump pad. the solder bump abuts on a side of the first bump pad and a side of the second bump pad.
