Samsung electronics co., ltd. (20240355709). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seungmin Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355709 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a base chip, a first semiconductor chip on the base chip, and a first fillet layer between them. The base chip includes a base substrate, through-electrodes, a protective layer, and trenches.
- The base chip has a base substrate with through-electrodes that form a transistor area.
- A protective layer surrounds the through-electrodes and covers the upper surface of the base substrate.
- Trenches vertically penetrate the protective layer, with first trenches between adjacent through-vias in the transistor area and second trenches in the outer side portion of the transistor area.
Potential Applications: - This technology can be applied in the semiconductor industry for advanced packaging solutions. - It can enhance the performance and reliability of semiconductor devices. - The design can be utilized in various electronic applications requiring compact and efficient packaging.
Problems Solved: - Provides improved thermal management for semiconductor devices. - Enhances electrical connectivity and signal transmission. - Offers a more robust and reliable packaging solution for advanced electronics.
Benefits: - Increased efficiency and performance of semiconductor devices. - Enhanced durability and longevity of electronic components. - Improved overall functionality of electronic systems.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be commercialized in the semiconductor manufacturing industry for producing high-performance electronic devices. It can cater to the growing demand for compact and efficient semiconductor packaging solutions in various electronic applications.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve thermal management in semiconductor devices? This technology enhances thermal management by providing efficient heat dissipation through the design of the base chip and the placement of through-electrodes.
2. What are the key advantages of using trenches in the protective layer of the base chip? Trenches in the protective layer help in optimizing the electrical connectivity and signal transmission between the base chip and the semiconductor chips, improving overall performance and reliability.
Original Abstract Submitted
a semiconductor package includes a base chip, a first semiconductor chip on the base chip, and a first fillet layer between the base chip and the first semiconductor chip. the base chip includes a base substrate, a plurality of through-electrodes penetrating through the base substrate, a protective layer surrounding the plurality of through-electrodes and covering an upper surface of the base substrate, and a plurality of trenches vertically penetrating the protective layer. the plurality of through-electrodes form a transistor area on the base substrate, and the plurality of trenches include first trenches disposed between adjacent through-vias in the transistor area and second trenches disposed in an outer side portion of the transistor area.
