Samsung electronics co., ltd. (20240355678). METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THEREIN AND SEMICONDUCTOR CHIPS FORMED THEREBY simplified abstract
METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THEREIN AND SEMICONDUCTOR CHIPS FORMED THEREBY
Organization Name
Inventor(s)
Kwangyong Lee of Suwon-si (KR)
METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THEREIN AND SEMICONDUCTOR CHIPS FORMED THEREBY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355678 titled 'METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THEREIN AND SEMICONDUCTOR CHIPS FORMED THEREBY
The semiconductor chip described in the patent application has an active layer with a bonding surface and a chamfered edge that extends through the top active layer.
- The active layer has a bonding surface that delineates an interface between the bottom and top active layers.
- The chamfered edge extends entirely through the top active layer to expose a sidewall but only partially through the bottom active layer.
- The protective layer covers at least a portion of the top surface of the active layer.
- The vertical level of the bottom of the chamfered edge may be higher than the vertical level of the top surface of the base substrate.
Potential Applications: - This technology could be used in the manufacturing of advanced semiconductor chips for various electronic devices. - It may find applications in the development of high-performance computing systems and mobile devices.
Problems Solved: - The technology addresses the need for improved semiconductor chip design with enhanced structural features. - It solves challenges related to the bonding and protection of active layers in semiconductor devices.
Benefits: - Enhanced structural integrity and protection for semiconductor chips. - Improved performance and reliability of electronic devices utilizing these chips.
Commercial Applications: - The technology could be valuable for semiconductor manufacturers looking to enhance the quality and performance of their products. - It may have implications for the development of next-generation electronic devices in various industries.
Questions about the Technology: 1. How does the chamfered edge in the active layer contribute to the overall performance of the semiconductor chip? 2. What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor chip design and manufacturing processes to understand how this technology fits into the current landscape.
Original Abstract Submitted
a semiconductor chip includes an active layer on a top surface of an underlying base substrate. the active layer has: bonding surface therein that delineates an interface between a bottom active layer and a top active layer extending on the bottom active layer, and a chamfered edge that extends entirely through the top active layer to fully expose a sidewall thereof but only partially through the bottom active layer, such that the chamfered edge has a vertical height greater than a thickness of the top active layer but less than a combined thickness of the top and bottom active layers. a protective layer is also provided, which covers at least a portion of a top surface of the active layer. a vertical level of a bottom of the chamfered edge may be higher than a vertical level of the top surface of the base substrate.
