Samsung electronics co., ltd. (20240355640). SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract

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SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Youngja Kim of Suwon-si (KR)

Minwoo Jeon of Suwon-si (KR)

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240355640 titled 'SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

Simplified Explanation: The patent application describes a method of manufacturing an electronic device using an airflow control cover to solder solder members on bonding pads of a substrate in a vapor generating chamber.

  • The substrate has bonding pads on its surface, solder members are attached to these pads, and an airflow control cover with vapor passage holes is placed above the solder members.
  • The substrate with the cover is loaded into a vapor generating chamber containing a heat transfer fluid.
  • The heat transfer fluid is heated to create vapor within the chamber.
  • The vapor passes through the airflow control cover to heat and solder the solder members on the bonding pads.

Key Features and Innovation:

  • Use of an airflow control cover with vapor passage holes to direct vapor towards solder members.
  • Soldering process takes place in a vapor generating chamber using a heat transfer fluid.
  • Efficient and controlled soldering of electronic components on a substrate.

Potential Applications:

  • Electronics manufacturing industry for soldering components on substrates.
  • Semiconductor industry for precise soldering processes.
  • Automation industry for efficient electronic device production.

Problems Solved:

  • Ensures precise and controlled soldering of electronic components.
  • Provides a method for efficient and reliable soldering in a vapor environment.
  • Reduces the risk of overheating or damaging electronic components during soldering.

Benefits:

  • Improved soldering accuracy and reliability.
  • Enhanced efficiency in electronic device manufacturing.
  • Reduced risk of component damage during soldering processes.

Commercial Applications: Potential commercial applications include:

  • Electronics manufacturing companies for mass production of electronic devices.
  • Semiconductor industry for precise soldering of components.
  • Automation industry for efficient and controlled soldering processes.

Questions about the Technology: 1. How does the use of an airflow control cover improve the soldering process in electronic device manufacturing? 2. What are the advantages of soldering components in a vapor generating chamber using a heat transfer fluid?

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Original Abstract Submitted

in a method of manufacturing an electronic device, a substrate including a plurality of bonding pads on a first surface thereof is provided. solder members are attached on the plurality of bonding pads respectively. an airflow control cover is positioned on the first surface of the substrate above the solder members, the airflow control cover including a plurality of vapor passage holes that allows air to flow toward the solder members. the substrate on which the airflow control cover is positioned is loaded into a vapor generating chamber that accommodates a heat transfer fluid therein. the heat transfer fluid is heated to place the heat transfer fluid in a vapor state within the chamber. the solder members are soldered by supplying the heat transfer fluid in the vapor state to surfaces of the solder members through the vapor passage holes of the airflow control cover.