Samsung electronics co., ltd. (20240353484). MEASURING APPARATUS FOR SEMICONDUCTOR DEVICE AND MEASURING METHOD USING THE SAME simplified abstract
Contents
MEASURING APPARATUS FOR SEMICONDUCTOR DEVICE AND MEASURING METHOD USING THE SAME
Organization Name
Inventor(s)
Beomsoo Hwang of Suwon-si (KR)
MEASURING APPARATUS FOR SEMICONDUCTOR DEVICE AND MEASURING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240353484 titled 'MEASURING APPARATUS FOR SEMICONDUCTOR DEVICE AND MEASURING METHOD USING THE SAME
The measuring apparatus for a semiconductor device consists of a lower frame for the first measurement process, a lower measuring portion, a lower vibration damping portion, an upper frame for the second measurement process, an upper measuring portion, an upper vibration damping portion, and support structures.
- Lower frame provides lower measurement space
- Lower measuring portion measures first semiconductor substrate
- Lower vibration damping portion offsets first vibration
- Upper frame provides upper measurement space
- Upper measuring portion measures second semiconductor substrate
- Upper vibration damping portion offsets second vibration
- Support structures support upper frame
Potential Applications: - Semiconductor manufacturing - Quality control in semiconductor production - Research and development in the semiconductor industry
Problems Solved: - Ensures accurate measurements of semiconductor substrates - Minimizes vibrations that could affect measurement precision
Benefits: - Improved accuracy in semiconductor measurements - Enhanced quality control in manufacturing processes - Increased efficiency in semiconductor production
Commercial Applications: Title: Semiconductor Device Measuring Apparatus for Precision Manufacturing This technology can be used in semiconductor fabrication facilities to ensure precise measurements of semiconductor substrates, leading to improved quality control and efficiency in production processes. The market implications include increased productivity and reduced waste in semiconductor manufacturing.
Questions about Semiconductor Device Measuring Apparatus: 1. How does the lower vibration damping portion offset vibrations in the measuring apparatus?
- The lower vibration damping portion is designed to absorb and counteract vibrations generated during the measurement process, ensuring accurate results.
2. What are the key differences between the lower and upper measuring portions in the apparatus?
- The lower measuring portion is configured to measure the first semiconductor substrate on a lower substrate stage, while the upper measuring portion measures the second semiconductor substrate on an upper substrate stage.
Original Abstract Submitted
a measuring apparatus for a semiconductor device includes a lower frame that provides a lower measurement space configured for performing a first measurement process, a lower measuring portion in the lower frame and configured to measure the first semiconductor substrate on a lower substrate stage, a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground, an upper frame that provides an upper measurement space configured for performing a second measurement process, an upper measuring portion in the upper frame to measure a second semiconductor substrate=on an upper substrate stage, an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground, and a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame.
