Intel corporation (20240357744). INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SUBSTRATES AND INTERFACES simplified abstract

INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SUBSTRATES AND INTERFACES

Organization Name

intel corporation

Inventor(s)

Rick Canham of West Richland WA (US)

Jeffory L. Smalley of Olympia WA (US)

Steven Adam Klein of Chandler AZ (US)

Shelby Ann Ferguson of El Dorado Hills CA (US)

INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SUBSTRATES AND INTERFACES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240357744 titled 'INTEGRATED CIRCUIT PACKAGES INCLUDING CARRIERS WITH INCORPORATED SUBSTRATES AND INTERFACES

The abstract of this patent application describes integrated circuit packages that include carriers with incorporated substrates and interfaces. The carrier includes a frame with an opening to receive an integrated circuit package, along with either a circuitry component on a substrate on the frame's surface or a cable interface directly coupled to the frame.

• Integrated circuit packages with carriers incorporating substrates and interfaces are disclosed.
• The carrier frame has an opening for the integrated circuit package.
• The carrier may have a circuitry component on a substrate or a cable interface.
• This innovation aims to enhance the functionality and connectivity of integrated circuit packages.
• The design allows for efficient integration of components within the package.

1. 1. 1. Potential Applications:

This technology can be applied in various industries such as telecommunications, consumer electronics, automotive, and aerospace for the development of advanced electronic devices.

1. 1. 1. Problems Solved:

This technology addresses the need for compact and efficient packaging of integrated circuits, providing a solution for enhancing connectivity and functionality.

1. 1. 1. Benefits:

- Improved integration of components - Enhanced connectivity - Compact design for space-saving - Increased efficiency in electronic devices

1. 1. 1. Commercial Applications:

Title: Advanced Integrated Circuit Packaging Technology for Enhanced Connectivity This technology can be utilized in the production of smartphones, tablets, GPS devices, and other electronic gadgets, improving their performance and connectivity.

1. 1. 1. Prior Art:

Readers can explore prior patents related to integrated circuit packaging, carrier design, and substrate integration to gain a deeper understanding of the technology's evolution.

1. 1. 1. Frequently Updated Research:

Researchers are constantly working on improving the design and functionality of integrated circuit packages, exploring new materials and manufacturing techniques to enhance performance and efficiency.

1. 1. 1. 1. Questions about Integrated Circuit Packages:

1. How does this technology impact the miniaturization of electronic devices? 2. What are the potential cost implications of implementing this advanced packaging technology?

1. Miniaturization of electronic devices is significantly impacted by this technology as it allows for more components to be integrated into a smaller space, leading to the development of smaller and more powerful devices. 2. The implementation of this advanced packaging technology may initially incur higher costs due to the complexity of the design and manufacturing processes. However, in the long run, the benefits of improved performance and efficiency may outweigh the initial investment.

Original Abstract Submitted

integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. an integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a substrate on a surface of the frame or (2) a cable interface directly coupled to the frame.