Intel corporation (20240356198). INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEVICES simplified abstract
Contents
INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEVICES
Organization Name
Inventor(s)
Sidharth Dalmia of Portland OR (US)
Trang Thai of Hillsboro OR (US)
INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240356198 titled 'INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEVICES
The abstract describes antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. An antenna module may include an IC package with a die and a package substrate that has a recess, along with an antenna patch coupled to the package substrate, positioned over or partially in the recess.
- Antenna module includes IC package with die and package substrate with a recess
- Antenna patch is coupled to the package substrate, positioned over or partially in the recess
Potential Applications: - Wireless communication devices - IoT devices - Smart home technology
Problems Solved: - Efficient antenna integration in compact devices - Improved signal reception and transmission
Benefits: - Enhanced performance of communication devices - Space-saving design for compact electronics
Commercial Applications: - Mobile phones - Tablets - Wearable technology
Questions about Antenna Modules: 1. How does the antenna patch improve signal reception? 2. What are the advantages of integrating antennas into IC packages?
Frequently Updated Research: - Ongoing developments in antenna design for improved performance and efficiency.
Original Abstract Submitted
disclosed herein are antenna boards, integrated circuit (ic) packages, antenna modules, and communication devices. for example, in some embodiments, an antenna module may include: an ic package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.
