Intel corporation (20240355980). PHOTONIC INTEGRATED CIRCUIT PACKAGES WITH SCALABLE HETEROGENEOUS INTEGRATION simplified abstract
Contents
PHOTONIC INTEGRATED CIRCUIT PACKAGES WITH SCALABLE HETEROGENEOUS INTEGRATION
Organization Name
Inventor(s)
Daniel Klowden of Portland OR (US)
Joshua Fryman of Corvallis OR (US)
PHOTONIC INTEGRATED CIRCUIT PACKAGES WITH SCALABLE HETEROGENEOUS INTEGRATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355980 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES WITH SCALABLE HETEROGENEOUS INTEGRATION
The abstract describes an IC package with microelectronic units capable of horizontal and vertical optical communications. Each microelectronic unit includes power delivery pillars, light source layers, an optical interconnect layer, and IC devices. The light source layers contain micro-LEDs for generating optical signals, while the optical interconnect layer enables horizontal optical communication between IC devices. Channels are included for heat dissipation, and vertical optical communication is facilitated between microelectronic units.
- IC package with microelectronic units for optical communications
- Power delivery pillars, light source layers, optical interconnect layer, and IC devices in each unit
- Micro-LEDs in light source layers for generating optical signals
- Optical interconnect layer enables horizontal communication between IC devices
- Channels for heat dissipation and vertical optical communication between units
Potential Applications: - Data centers - Telecommunications - High-performance computing
Problems Solved: - Enhanced optical communication within IC packages - Improved heat dissipation for better performance
Benefits: - Faster data transmission - Reduced heat-related issues - Enhanced overall performance
Commercial Applications: Title: "Optical Communication IC Packages Revolutionize Data Centers" This technology can be used in data centers to improve data transmission speeds and overall performance, making it a valuable asset for companies relying on high-speed data processing.
Questions about the technology: 1. How does this technology compare to traditional IC packages in terms of performance? 2. What are the potential cost implications of implementing this technology in data centers?
Frequently Updated Research: Ongoing research focuses on optimizing the design of microelectronic units for even greater efficiency and performance in optical communications.
Original Abstract Submitted
an ic package may include a stack of microelectronic units capable of horizontal and vertical optical communications. a microelectronic unit includes one or more power delivery pillars, two light source layers, an optical interconnect layer between the light source layers, and one or more ic devices arranged on the optical interconnect layer. a light source layer includes micro-leds that emit light used for generating optical signals. the optical interconnect layer includes one or more optical interconnects that enable horizontal optical communication, e.g., transmission of optical signals between the ic devices. a light source layer in the microelectronic unit can facilitate optical communications with another microelectronic unit that is below or above the microelectronic unit. a channel may exist above or below the light source layer to promote dissipation of heat generated by the ic devices. light from the light source layer may pass through the channel for vertical optical communication.
