Intel corporation (20240355890). CONDUCTIVE BRIDGE THROUGH DIELECTRIC WALL BETWEEN SOURCE OR DRAIN CONTACTS simplified abstract

CONDUCTIVE BRIDGE THROUGH DIELECTRIC WALL BETWEEN SOURCE OR DRAIN CONTACTS

Organization Name

intel corporation

Inventor(s)

Leonard P. Guler of Hillsboro OR (US)

Shengsi Liu of Portland OR (US)

Saurabh Acharya of Hillsboro OR (US)

Baofu Zhu of Portland OR (US)

Meenakshisundaram Ramanathan of Hillsboro OR (US)

Charles H. Wallace of Portland OR (US)

Ankit Kirit Lakhani of Hillsboro OR (US)

CONDUCTIVE BRIDGE THROUGH DIELECTRIC WALL BETWEEN SOURCE OR DRAIN CONTACTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240355890 titled 'CONDUCTIVE BRIDGE THROUGH DIELECTRIC WALL BETWEEN SOURCE OR DRAIN CONTACTS

The abstract describes techniques for forming semiconductor devices with a conductive bridge between topside contacts on adjacent source or drain regions, extending through a dielectric wall.

• A first semiconductor device includes a first gate structure on a first semiconductor region connected to a first source or drain region.
• A second semiconductor device includes a second gate structure on a second semiconductor region connected to a second source or drain region.
• A conductive bridge connects a first conductive contact on the first region with a second conductive contact on the adjacent second region through a dielectric wall.

Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices for various electronic applications.

Problems Solved: - Enables efficient connection between adjacent source or drain regions in semiconductor devices. - Facilitates improved performance and functionality of electronic devices.

Benefits: - Enhanced conductivity and connectivity in semiconductor devices. - Increased efficiency and reliability of electronic circuits.

Commercial Applications: - This technology has potential applications in the semiconductor industry for the development of high-performance electronic devices.

Questions about Semiconductor Device with Conductive Bridge: 1. How does the conductive bridge improve the performance of semiconductor devices?

  - The conductive bridge enhances connectivity between adjacent regions, leading to improved device functionality.

2. What are the key advantages of using a conductive bridge in semiconductor devices?

  - The use of a conductive bridge enables efficient connection and enhanced conductivity in electronic circuits.

Original Abstract Submitted

techniques are provided herein to form semiconductor devices that include a conductive bridge between topside contacts on adjacent source or drain regions. the conductive bridge extends through a dielectric wall that separates the adjacent source or drain regions. in an example, a first semiconductor device includes a first gate structure around or otherwise on a first semiconductor region (or channel region) that extends from a first source or drain region, and a second adjacent semiconductor device includes a second gate structure around or otherwise on a second semiconductor region that extends from a second source or drain region. a conductive bridge connects a first conductive contact on a top surface of the first source or drain region with a second conductive contact on a top surface of the adjacent second source or drain region through a dielectric wall that otherwise separates the conductive contacts.